公开(公告)号：US09699901B2

公开(公告)日：2017-07-04

申请号：US14016398

申请日：2013-09-03

Applicant: Huawei Technologies Co., Ltd.

Inventor： Kai Yao ,  Yongfa Zhu ,  Yingpei Huang

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/117 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10416

Abstract: A golden finger and a board edge interconnecting device are disclosed. The golden finger includes a printed circuit board (PCB) surface layer and at least one PCB inner layer, where a metal foil of the PCB inner layer is connected to a metal foil of the PCB surface layer through a current-carrying structure, so that a current-carrying channel of the golden finger passes through the PCB surface layer and the PCB inner layer. The board edge interconnecting device includes the foregoing golden finger. In the embodiments, a current-carrying capacity of a PCB in the golden finger is increased without increasing a size and thickness of a copper foil of the PCB in the golden finger, thereby effectively improving the current-carrying capacity of the PCB in the golden finger.

公开(公告)号：US20140004720A1

公开(公告)日：2014-01-02

申请号：US14016398

申请日：2013-09-03

Applicant: Huawei Technologies Co., Ltd.

Inventor： Kai Yao ,  Yongfa Zhu ,  Yingpei Huang

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10416

Abstract: A golden finger and a board edge interconnecting device are disclosed. The golden finger includes a printed circuit board (PCB) surface layer and at least one PCB inner layer, where a metal foil of the PCB inner layer is connected to a metal foil of the PCB surface layer through a current-carrying structure, so that a current-carrying channel of the golden finger passes through the PCB surface layer and the PCB inner layer. The board edge interconnecting device includes the foregoing golden finger. In the embodiments, a current-carrying capacity of a PCB in the golden finger is increased without increasing a size and thickness of a copper foil of the PCB in the golden finger, thereby effectively improving the current-carrying capacity of the PCB in the golden finger.

Abstract translation: 公开了金手指和板边缘互连装置。 金手指包括印刷电路板（PCB）表面层和至少一个PCB内层，其中PCB内层的金属箔通过载流结构连接到PCB表面层的金属箔，使得 金手指的载流通道穿过PCB表面层和PCB内层。 板边缘互连装置包括上述金手指。 在实施例中，金手指上的PCB的载流能力增加，而不增加金手指中PCB的铜箔的尺寸和厚度，从而有效地提高了黄金中PCB的载流能力 手指。