公开(公告)号：US20140076610A1

公开(公告)日：2014-03-20

申请号：US13934635

申请日：2013-07-03

Applicant: Electronics and Telecommunications Research Institute

Inventor： Yong Suk YANG ,  In-Kyu You ,  Minseok Kim ,  Soon-Won Jung ,  Bock Soon Na ,  Sang Chul Lim

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/02 ,  H01L51/0022 ,  H01L51/003 ,  H01L51/102 ,  H01L51/441 ,  H01L51/5203 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/207 ,  H05K2201/0376

Abstract: Disclosed are a method for manufacturing a planarizing printed electronic device and a planarizing printed electronic device manufactured by using the same by simply implementing a large-area embedded printed electronic device by coupling a printing process such as inkjet printing and gravure printing and a transferring process using a laminating device and particularly, solving defects due to large surface roughness and a thickness of a printed layer included in the printed electronic device, when manufacturing an embedded printed electronic device where a printed layer is embedded in a substrate.

Abstract translation: 公开了一种制造平面印刷电子器件的方法和通过使用它们简单地实现大面积嵌入式印刷电子器件而制造的平面化印刷电子器件，其通过联接诸如喷墨印刷和凹版印刷的印刷工艺和使用 层压装置，特别是在制造嵌入印刷电子器件时，其中印刷层嵌入基板中，特别是解决了印刷电子器件中包括的印刷层的大的表面粗糙度和厚度的缺陷。