知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

56 records (took 0.028 seconds)

    Method for localized annealing of chemically strengthened glass
    22.
    发明授权
    Method for localized annealing of chemically strengthened glass 有权

    公开(公告)号：US09908805B2

    公开(公告)日：2018-03-06

    申请号：US14913890

    申请日：2014-08-21

    Applicant: CORNING INCORPORATED

    Inventor： Thomas Michael Cleary ,  Mark Stephen Friske ,  Robert Stephen Wagner

    IPC: C03B25/08 ,  B32B17/10 ,  C03C23/00 ,  C03C21/00

    CPC classification number: C03B25/08 ,  B32B17/10091 ,  B32B17/10137 ,  B32B17/10743 ,  B32B17/10761 ,  B32B17/1077 ,  B32B17/10788 ,  B32B2605/00 ,  C03C21/00 ,  C03C23/0025 ,  C03C23/0065

    Abstract: A method of providing locally annealed regions for a glass article comprising: (a) providing a strengthened glass article having a first surface compressive stress and a first depth of layer of compressive stress; (b) targeting first portions of the glass article on a first side thereof; (c) annealing the targeted first portions to a second surface compressive stress and a second depth of layer of compressive stress; and (d) repeating steps (b) and (c) to create a pattern of annealed portions of the glass article on the first side thereof. Targeted annealing can be done e.g. by focusing a laser or using microwave energy or an induction source. A method for making a laminate structure comprising a first glass layer (12), a second glass layer (16), and at least one polymer interlayer (14) intermediate the first and second glass layers. The first glass layer (12) can be comprised of a strengthened glass having a first portion with a first surface compressive stress and a first depth of layer of compressive stress and a second portion with a second surface compressive stress and a second depth of layer of compressive stress. In other embodiments, the second glass layer (16) can be comprised of a strengthened glass having a third portion with a third surface compressive stress and a third depth of layer of compressive stress and a fourth portion with a fourth surface compressive stress and a fourth depth of layer of compressive stress.

    TRANSPARENT MATERIAL CUTTING WITH ULTRAFAST LASER & BEAM OPTICS
    27.
    发明申请
    TRANSPARENT MATERIAL CUTTING WITH ULTRAFAST LASER & BEAM OPTICS 有权
    透明材料切割与超快激光和光束光学

    公开(公告)号：US20150166397A1

    公开(公告)日：2015-06-18

    申请号：US14529801

    申请日：2014-10-31

    Applicant: Corning Incorporated

    Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

    IPC: C03B33/10 ,  C03B33/08

    CPC classification number: B23K26/53 ,  B23K26/0624 ,  B23K26/382 ,  C03B33/0222 ,  Y02P40/57

    Abstract: A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.

    Abstract translation: 用于激光钻孔材料的系统包括被配置为产生波长小于或等于约850nm的脉冲激光束的脉冲激光器，所选择的波长使得材料在该波长处基本上是透明的。 该系统还包括位于激光束的光束路径中的光学组件，其配置成在光学组件的光束出射侧将激光束转换成沿光束传播方向定向的激光束焦点。

Patent Agency Ranking