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    LIQUID COOLING DISTRIBUTION IN A MODULAR ELECTRONIC SYSTEM
    21.
    发明申请
    LIQUID COOLING DISTRIBUTION IN A MODULAR ELECTRONIC SYSTEM 审中-公开

    公开(公告)号：US20200093031A1

    公开(公告)日：2020-03-19

    申请号：US16131629

    申请日：2018-09-14

    Applicant: CISCO TECHNOLOGY, INC.

    Inventor： Rakesh Chopra ,  Mandy Hin Lam ,  M. Baris Dogruoz

    IPC: H05K7/20 ,  H05K7/02

    Abstract: In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.

    Liquid cooling distribution in a modular electronic system
    22.
    发明授权
    Liquid cooling distribution in a modular electronic system 有权

    公开(公告)号：US10582639B1

    公开(公告)日：2020-03-03

    申请号：US16131629

    申请日：2018-09-14

    Applicant: CISCO TECHNOLOGY, INC.

    Inventor： Rakesh Chopra ,  Mandy Hin Lam ,  M. Baris Dogruoz

    IPC: H05K7/20 ,  H05K7/02

    Abstract: In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.

    Heat transfer for electronic equipment
    23.
    发明授权
    Heat transfer for electronic equipment 有权
    电子设备传热

    公开(公告)号：US09379039B2

    公开(公告)日：2016-06-28

    申请号：US14018189

    申请日：2013-09-04

    Applicant: CISCO TECHNOLOGY, INC.

    Inventor： Mandy Hin Lam ,  Hong Tran Huynh ,  M. Baris Dogruoz

    IPC: H05K7/20 ,  H01L23/473 ,  H01L23/40

    CPC classification number: H01L23/473 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.

    Abstract translation: 提供了一种装置，其包括平面导热材料，其包括构造成在第一集成电路和第一散热器之间传导热量的第一散热器传导部分，第二散热器传导部分，被配置为在第二集成电路和 第二散热器和热桥部分，其构造成在第一散热器传导部分和第二散热器传导部分之间传导热量，使得热桥部分允许对第一集成电路和第二散热器传导部分之间的高度差进行挠曲补偿 第二集成电路。

    High Insertion Force Ejector
    24.
    发明申请
    High Insertion Force Ejector 有权
    高插入力喷射器

    公开(公告)号：US20140187068A1

    公开(公告)日：2014-07-03

    申请号：US13728115

    申请日：2012-12-27

    Applicant: CISCO TECHNOLOGY, INC.

    Inventor： Vic Hong Chia ,  Mandy Hin Lam ,  Frank Jun ,  Hong Tran Huynh

    IPC: H05K7/14

    CPC classification number: H05K7/1489 ,  H01R13/62933 ,  H01R13/62938 ,  H01R13/62966 ,  H01R13/62972 ,  H01R13/62977 ,  Y10T29/49117

    Abstract: A high insertion force ejector may be provided. The high insertion force ejector may comprise an ejector mounting base, a pressure bar-ejector tooth, a first cam, and a second cam. The pressure bar-ejector tooth may be connected to the ejector mounting base. A lever handle may be operatively connected to the pressure bar-ejector and the ejector mounting base. The first cam and the second cam may be operatively connected to the pressure bar-ejector tooth and the lever handle.

    Abstract translation: 可以提供高插入力的喷射器。 高插入力推出器可以包括喷射器安装基座，压力杆排出器齿，第一凸轮和第二凸轮。 压杆推出器齿可以连接到喷射器安装座。 杠杆手柄可以可操作地连接到压力杆 - 喷射器和喷射器安装座。 第一凸轮和第二凸轮可以可操作地连接到压杆排出器齿和杠杆手柄。

    AIR FLOW SYSTEM
    25.
    发明申请
    AIR FLOW SYSTEM 有权
    空气流量系统

    公开(公告)号：US20140098492A1

    公开(公告)日：2014-04-10

    申请号：US13646416

    申请日：2012-10-05

    Applicant: Cisco Technology, Inc.

    Inventor： Mandy Hin Lam ,  Phillip S. Ting ,  Susheela Nanjunda Rao Narasimhan

    IPC: H05K7/20 ,  F28D15/00 ,  H05K7/00 ,  F28F13/06

    CPC classification number: H05K7/20563 ,  F28F13/06 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20572 ,  H05K7/20727 ,  H05K9/0041 ,  H01L2924/00

    Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.

    Abstract translation: 在一个示例性实施例中提供了一种设备，并且包括具有布置在面板的前部上的多个狭槽的面板，附接到面板的顶部的顶板以及附接到面板和顶板的屏幕。 通道可以设置在面板的后面，并且在面板的顶部的底表面，顶板的底表面和屏幕的顶表面之间。 屏幕可以包括多个开口。 在具体实施例中，该装置可以可移除地附接到开关的可移除线卡上。 在一个具体实施例中，空气可以通过在设备后面沿着通道并通过多个开口的风扇被引导通过线路卡上的一个或多个发热部件。

    Air cooled cage design
    29.
    发明授权
    Air cooled cage design 有权

    公开(公告)号：US11439041B2

    公开(公告)日：2022-09-06

    申请号：US16922383

    申请日：2020-07-07

    Applicant: Cisco Technology, Inc.

    Inventor： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

    IPC: H01R13/00 ,  H05K7/20 ,  H05K7/14 ,  G02B6/42 ,  H01R13/518

    Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

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