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    Electronic devices having interconnect radiation mitigation capabilities
    22.
    发明授权
    Electronic devices having interconnect radiation mitigation capabilities 有权
    具有互连辐射减轻能力的电子设备

    公开(公告)号：US09497054B1

    公开(公告)日：2016-11-15

    申请号：US14829418

    申请日：2015-08-18

    Applicant: Apple Inc.

    Inventor： Tianqi Li ,  Cheung-Wei Lam ,  Vaneet Pathak

    IPC: H04B1/38 ,  H04L27/20 ,  H04B1/04

    CPC classification number: H04B1/0475 ,  H04B15/02 ,  H04L25/0264

    Abstract: Electronic devices may include unshielded connectors that convey radio-frequency signals with external devices. A first electronic device may include transmitter circuitry that transmits radio-frequency signals to phase shifting circuitry. The phase shifting circuitry may pass the radio-frequency signals to a first conductive contact of a connector on the first device, may generate modified signals by applying a phase shift of approximately 180 degrees to the radio-frequency signals, and may provide the modified signals to a second conductive contact on the connector. To mitigate undesirable resonance and radiation at the connector, the connector may concurrently convey the radio-frequency signals and the modified signals to an external device over the first and second contacts while mating contacts on a connector of the external electronic device are in electrical contact with the first and second conductive contacts.

    Abstract translation: 电子设备可以包括用外部设备传送射频信号的非屏蔽连接器。 第一电子设备可以包括将射频信号发射到相移电路的发射机电路。 相移电路可以将射频信号传递到第一设备上的连接器的第一导电触点，可以通过向射频信号施加大约180度的相移来产生修改的信号，并且可以提供修改的信号 到连接器上的第二导电接触。 为了减轻连接器处的不期望的共振和辐射，连接器可以将外部设备的射频信号和修改的信号同时传送到第一和第二触点上，而外部电子设备的连接器上的配合触点与 第一和第二导电触点。

    Electronic device with frequency dithering
    24.
    发明授权
    Electronic device with frequency dithering 有权

    公开(公告)号：US12009760B2

    公开(公告)日：2024-06-11

    申请号：US18341474

    申请日：2023-06-26

    Applicant: Apple Inc.

    Inventor： Sujeet Milind Patole ,  Cheung-Wei Lam ,  Mahmoud N Mahmoud

    IPC: H02M7/48 ,  H02M1/00 ,  H02M1/12 ,  H02M7/529

    CPC classification number: H02M7/4803 ,  H02M1/0041 ,  H02M1/12 ,  H02M7/529

    Abstract: An electronic device may include an inverter. The inverter may convert direct current (DC) power to alternating current (AC) power. The inverter may use a clock signal at a given frequency to output corresponding alternating current signals at the given frequency. The inverter may receive a dithered clock signal that is frequency dithered using a modulating signal. The dithered clock signal may have at least three different frequency levels during a repeated cycle of the modulating signal. The at least three different frequency levels may include a fundamental frequency, a first frequency that is lower than the fundamental frequency, and a second frequency that is higher than the fundamental frequency. The dithered clock signal may be, during the repeated cycle of the modulating signal, at the fundamental frequency for fewer total periods than at the first frequency and for fewer total periods than at the second frequency.

    ELECTROMAGNETIC BANDGAP STRUCTURES
    26.
    发明申请
    ELECTROMAGNETIC BANDGAP STRUCTURES 有权

    公开(公告)号：US20220413789A1

    公开(公告)日：2022-12-29

    申请号：US17900680

    申请日：2022-08-31

    Applicant: Apple Inc.

    Inventor： Mahmoud N. Mahmoud ,  Cheung-Wei Lam ,  Ali Foudazi ,  Le Wang ,  Qianyi Zhao ,  Kedi Zhang ,  Xingchao C. Yuan ,  Jon F. Housour ,  Gary Chung

    IPC: G06F3/14 ,  G06F3/044 ,  G06F3/041

    Abstract: Devices for mitigating or stopping noise or surface current on a display are provided. An electronic device including a display may include a display substrate, a mid-support plate that is adjacent to the display substrate, and a lower support plate that is adjacent to the mid-support plate. A space exists between the mid-support plate and the lower support plate. The mid-support plate includes one or more electromagnetic band gap (EBG) structures formed through the mid-support plate, one or more electromagnetic band gap structures mounted onto the mid-support plate, or both. The one or more electromagnetic band gap structures may mitigate or stop surface current flow across the display.

    Wireless Power System With Ambient Field Nulling
    27.
    发明申请
    Wireless Power System With Ambient Field Nulling 有权

    公开(公告)号：US20210099022A1

    公开(公告)日：2021-04-01

    申请号：US17119900

    申请日：2020-12-11

    Applicant: Apple Inc.

    Inventor： Jouya Jadidian ,  Martin Schauer ,  Andro Radchenko ,  Cheung-Wei Lam ,  Ketan Shringarpure ,  Vaneet Pathak

    IPC: H02J50/70 ,  H02J50/12 ,  H01F27/38 ,  H01F27/29 ,  H01F27/28 ,  H01F38/14 ,  H02J50/10 ,  H02J50/40

    Abstract: A wireless power system uses a wireless power transmitting device to transmit wireless power to wireless power receiving devices. The wireless power transmitting device has wireless power transmitting coils that extend under a wireless charging surface. Non-power-transmitting coils and magnetic sensors may be included in the wireless power transmitting device. During wireless power transfer operations, control circuitry in the wireless power transmitting device adjusts drive signals applied to the coils to reduce ambient magnetic fields. The drive signal adjustments are made based on device type information and other information on the wireless power receiving devices and/or magnetic sensor readings from the magnetic sensors. In-phase or out-of-phase drive signals are applied to minimize ambient fields depending on device type.

    Self shielding coaxial capacitor structures
    29.
    发明授权
    Self shielding coaxial capacitor structures 有权

    公开(公告)号：US10199172B2

    公开(公告)日：2019-02-05

    申请号：US15275372

    申请日：2016-09-24

    Applicant: Apple Inc.

    Inventor： Paul A. Martinez ,  Jason C. Sauers ,  Cheung-Wei Lam ,  Federico P. Centola ,  Andro Radchenko ,  Martin Schauer

    IPC: H01G4/35 ,  H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  H01G4/12 ,  H01G4/008

    Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.

    SELF SHIELDING COAXIAL CAPACITOR STRUCTURES
    30.
    发明申请
    SELF SHIELDING COAXIAL CAPACITOR STRUCTURES 审中-公开

    公开(公告)号：US20170207028A1

    公开(公告)日：2017-07-20

    申请号：US15275372

    申请日：2016-09-24

    Applicant: Apple Inc.

    Inventor： Paul A. Martinez ,  Jason C. Sauers ,  Cheung-Wei Lam ,  Federico P. Centola ,  Andro Radchenko ,  Martin Schauer

    IPC: H01G4/35 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/012

    CPC classification number: H01G4/35 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/232

    Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.

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