-
公开(公告)号:US10779421B1
公开(公告)日:2020-09-15
申请号:US16434628
申请日:2019-06-07
Applicant: Apple Inc.
Inventor: Shravan Bharadwaj
Abstract: This application relates to a case for a portable electronic device. The case includes a housing having walls that define a cavity, where the walls are capable of carrying the portable electronic device within the cavity. The walls carry operational components that include a processor capable of providing instructions, a magnetic circuit capable of generating a magnetic field in response to receiving the instructions from the processor, and a magnetosensitive layer that includes (i) a matrix, and (ii) magnetic particles interspersed within the matrix according to a first distribution, where when the magnetosensitive layer is exposed to the magnetic field, the magnetic particles are rearranged according to a second distribution.
-
公开(公告)号:US10680161B1
公开(公告)日:2020-06-09
申请号:US15785175
申请日:2017-10-16
Applicant: Apple Inc.
Inventor: Shravan Bharadwaj
IPC: H01L41/09 , H01L41/08 , H01L41/047 , H01L41/18 , H03K17/96 , H04R17/00 , H01L41/317 , H01L41/187
Abstract: An electronic device may have input devices and/or output devices based on piezoelectric components. Piezoelectric components may include piezoelectric ink in which particles of piezoelectric material are dispersed in a binder. The piezoelectric ink may be printed or otherwise deposited onto a substrate to form piezoelectric ink traces. The piezoelectric ink traces may be deposited on flexible substrates such as elastic speaker diaphragms or flexible fabric layers. The piezoelectric traces may be part of a key in a keyboard or a stand-alone button. In arrangements where the piezoelectric trace forms part of a key in a keyboard, the piezoelectric trace may be coupled to a grid of horizontal and vertical signal lines. The signal lines may convey key press data from the piezoelectric trace to control circuitry and/or may supply control signals from the control circuitry to the piezoelectric trace to produce haptic output.
-
公开(公告)号:US10582631B2
公开(公告)日:2020-03-03
申请号:US15655311
申请日:2017-07-20
Applicant: Apple Inc.
Inventor: Shravan Bharadwaj
IPC: H05K5/02 , H05K1/03 , H05K1/09 , H05K3/10 , H05K3/32 , G06F1/16 , H04M1/18 , H05K1/02 , H05K3/00 , H05K3/46
Abstract: A housing made from a circuit laminate includes first and second layers coupled together. Each includes a rigid, electrically insulating non-planar structural layer, flexible conductive traces disposed on surfaces of the structural layer, and flexible connector layers contacting to the flexible conductive traces. The housing may be formed from the circuit laminate using thermoforming or another process that co-molds the first and second layers. The structural layers stiffen the housing and/or form an environmental or other barrier so that the housing protects an internal component.
-
-