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    PRECURSOR FORMULATIONS FOR POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS
    23.
    发明申请
    PRECURSOR FORMULATIONS FOR POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS 审中-公开

    公开(公告)号：US20200001433A1

    公开(公告)日：2020-01-02

    申请号：US16541641

    申请日：2019-08-15

    Applicant: Applied Materials, Inc.

    Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Ashavani KUMAR ,  Fred C. REDEKER ,  Nag B. PATIBANDLA

    IPC: B24D18/00 ,  B24D3/28

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

    INTEGRATING 3D PRINTING INTO MULTI-PROCESS FABRICATION SCHEMES
    24.
    发明申请
    INTEGRATING 3D PRINTING INTO MULTI-PROCESS FABRICATION SCHEMES 审中-公开

    公开(公告)号：US20190299537A1

    公开(公告)日：2019-10-03

    申请号：US16289213

    申请日：2019-02-28

    Applicant: Applied Materials, Inc.

    Inventor： William H. MCCLINTOCK ,  Rajeev BAJAJ ,  Jason G. FUNG ,  Daniel REDFIELD

    IPC: B29C64/393 ,  G06F9/30 ,  G01B9/02

    Abstract: Embodiments disclosed herein provide methods of forming bond pad redistribution layers (RDLs) in a fan-out wafer level packaging (FOWLP) scheme using an additive manufacturing process. In one embodiment, a method of forming a redistribution layer includes positioning a carrier substrate on a manufacturing support of an additive manufacturing system, the carrier substrate including a plurality of singulated devices, detecting one or more fiducial features corresponding to each of the plurality of singulated devices, determining actual positions of each of the plurality of singulated devices relative to one or more components of the additive manufacturing system, generating printing instructions for forming a patterned dielectric layer based on the actual positions of each of the plurality of singulated devices, and forming the patterned dielectric layer using the printing instructions.

    METHOD AND APPARATUS FOR FORMING POROUS ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS
    26.
    发明申请
    METHOD AND APPARATUS FOR FORMING POROUS ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS 审中-公开

    公开(公告)号：US20190202024A1

    公开(公告)日：2019-07-04

    申请号：US16298802

    申请日：2019-03-11

    Applicant: Applied Materials, Inc.

    Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

    IPC: B24B37/24

    CPC classification number: B24B37/24

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

    ABRASIVE DELIVERY POLISHING PADS AND MANUFACTURING METHODS THEREOF
    27.
    发明申请
    ABRASIVE DELIVERY POLISHING PADS AND MANUFACTURING METHODS THEREOF 审中-公开

    公开(公告)号：US20190039204A1

    公开(公告)日：2019-02-07

    申请号：US16048574

    申请日：2018-07-30

    Applicant: Applied Materials, Inc.

    Inventor： Ashwin CHOCKALINGAM ,  Rajeev BAJAJ ,  Ashavani KUMAR ,  Daniel REDFIELD

    IPC: B24B37/26 ,  B24B37/24

    Abstract: Embodiments of the present disclosure provide for abrasive delivery (AD) polishing pads and manufacturing methods thereof. In one embodiment, a method of forming a polishing article includes forming a sub-polishing element from a first curable resin precursor composition and forming a plurality of polishing elements extending from the sub-polishing element. Forming the plurality of polishing elements includes forming a continuous polymer phase from a second curable resin precursor composition and forming a plurality of discontinuous abrasive delivery features disposed within the continuous polymer phase. The sub-polishing element is formed by dispensing a first plurality of droplets of the first curable resin precursor composition. The plurality polishing elements are formed by dispensing a second plurality of droplets of the second curable resin precursor composition. In some embodiments, the discontinuous abrasive delivery features comprise a water soluble material having abrasive particles interspersed therein.

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