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公开(公告)号：US20170069956A1
公开(公告)日：2017-03-09
申请号：US15233891
申请日：2016-08-10
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , B29C37/0082 , B29C45/14311 , B29C45/14467 , B29L2031/34 , B29L2031/3437 , G06F1/1626 , G06F1/1633 , G06F1/1656 , G06F2200/1633 , H04M1/0249 , H04M1/0283
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括第一部件和第二部件，第一部件和第二部件通过间隙与第一部件分离。 壳体还包括第一模制元件，其至少部分地设置在间隙内并且限定互锁特征的至少一部分，以及至少部分地设置在间隙内并机械地接合互锁特征的第二模制元件。 第一部件，第二部件和第二模制部件形成壳体的外表面的一部分。 还公开了一种形成壳体的方法。
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公开(公告)号：US20160277054A1
公开(公告)日：2016-09-22
申请号：US15032041
申请日：2013-10-31
Applicant: APPLE INC.
Inventor： Romain A. Teil , Michael B. Wittenberg , Steven J. Martisauskas , Kuo-Hua Sung
CPC classification number: H04B1/3888 , G06F1/1633 , G06F1/1656 , G06F1/182 , G06F1/183 , H05K1/0289 , H05K1/056 , H05K1/09 , H05K1/162 , H05K1/18 , H05K3/103 , H05K3/32 , H05K2201/0999 , H05K2201/10015 , H05K2201/10022 , H05K2201/10151
Abstract: An electronic device may include a mechanical structure that mechanically supports the electronic device. One or more traces may be formed on one or more surfaces of the mechanical structure. Other electrical components may also be mounted on the surface of the mechanical structure and may or may not be connected to one or more of the traces. Additionally, one or more passivation layers may be formed on one or more of the surfaces, traces, and/or other electrical components and one or more traces and/or other electrical components may be intermixed with such passivation layers. In this way, the mechanical structure may be operable to function as an electrical component of the electronic device.
Abstract translation: 电子设备可以包括机械地支撑电子设备的机械结构。 可以在机械结构的一个或多个表面上形成一个或多个迹线。 其他电气部件也可以安装在机械结构的表面上，并且可以或可以不连接到一个或多个迹线。 另外，一个或多个钝化层可以形成在一个或多个表面，迹线和/或其它电气部件上，并且一个或多个迹线和/或其它电气部件可以与这种钝化层混合。 以这种方式，机械结构可以用作电子设备的电气部件。
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公开(公告)号：US09125299B2
公开(公告)日：2015-09-01
申请号：US13707175
申请日：2012-12-06
Applicant: Apple Inc.
Inventor： Michael B. Wittenberg , Nicholas G. Merz , Shayan Malek
IPC: H05K7/20 , H05K1/02 , H01L23/34 , H01L23/367 , H05K1/00 , H01L23/473 , H01L23/373
CPC classification number: H05K1/0201 , H01L23/34 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K2201/09063 , H05K2201/09781 , H01L2924/00
Abstract: Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground. The circuit board assembly may further include one or more electronic components electrically coupled to the signal layer using one or more of the signal traces, with the heat sink traces arranged around the one or more electronic components such that heat is selectively directed from one location of the board (e.g. a heat source, or hotter one of a plurality of components) to another location of the board (e.g. a perimeter of the board, or off the board).
Abstract translation: 这里描述了可以被配置用于定向热传输的电子部件和印刷电路板组件的示例。 根据本文实施例的电路板组件可以包括多个堆叠的平面层，包括具有多个信号迹线的信号层，使用绝缘层与信号层分离的接地层，以及延伸的多个散热片迹线 通过绝缘层的厚度的至少一部分从接地层，多个散热片轨迹中的每一个与信号迹线电绝缘并耦合到地面。 电路板组件还可以包括使用一个或多个信号迹线电耦合到信号层的一个或多个电子部件，散热片轨迹布置在一个或多个电子部件周围，使得热量从 板（例如，热源或多个部件中较热的部件）到板的另一位置（例如板的周边或板上）。
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公开(公告)号：US20140177181A1
公开(公告)日：2014-06-26
申请号：US13726890
申请日：2012-12-26
Applicant: APPLE INC.
Inventor： Shayan Malek , Gregory N. Stephens , Michael B. Wittenberg , Jared M. Kole , Warren Z. Jones
CPC classification number: H05K3/30 , H05K9/003 , H05K2201/09063 , H05K2201/10371 , H05K2201/10409 , Y10T29/49117 , Y10T29/4913
Abstract: Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.
Abstract translation: 电气部件安装在电子设备壳体中的印刷电路上。 屏蔽罐结构可以包括具有导电垫片的金属板屏蔽罐层。 印刷电路可以具有开口。 螺丝穿过印刷电路中的开口和导电垫圈和金属板护罩罐层中的开口，以将屏蔽罐结构固定到壳体上。 当固定时，垫圈中的唇缘位于印刷电路基板和壳体之间。 垫圈可以由导电弹性体材料形成。 屏蔽罐盖和柔性印刷电路可以嵌入在导电弹性体材料内，其提供热传导路径以从盖下方的电气部件散发热量。 位于柔性印刷电路基板中的弯曲部的相对侧上的屏蔽罐构件可以通过导电弹性体桥接结构耦合。
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公开(公告)号：US12277886B2
公开(公告)日：2025-04-15
申请号：US18667315
申请日：2024-05-17
Applicant: Apple Inc.
Inventor： Ying-Chih Wang , Michael J. Brown , Michael B. Wittenberg , Paul C. Kelley , Rasamy Phouthavong , Tyler R. Kakuda , Jean-Pierre S. Guillou , Marwan Rammah
Abstract: An electronic device may have a display with pixels configured to display an image. The pixels may be overlapped by a cover layer. The display may have peripheral edges with curved cross-sectional profiles. An inactive area in the display may be formed along a peripheral edge of the display or may be surrounded by the pixels. Electrical components such as optical components may be located in the inactive area. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels, may have an opening that overlaps portions of the inactive area, may have an output surface that overlap portions of the inactive area, and/or may convey light associated with optical components in the electronic device.
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Patent Agency Ranking
公开(公告)号：US12041738B2
公开(公告)日：2024-07-16
申请号：US17538557
申请日：2021-11-30
Applicant: Apple Inc.
Inventor： Que Anh S. Nguyen , Michael B. Wittenberg
IPC: H05K5/03 , H05K5/00 , H05K5/02 , H10K77/10 , H10K102/00
CPC classification number: H05K5/03 , H05K5/0017 , H05K5/0226 , H10K77/111 , H10K2102/311
Abstract: A foldable display may have a display cover layer and a flexible display panel. The foldable display may bend around a bend axis. The display panel may have an array of pixels configured to display an image through the display cover layer. The display cover layer may be formed from a layer of glass. A recess may be formed in the layer of glass that extends along the bend axis. The recess may form a flexible locally thinned portion in the layer of glass that allows the glass layer to bend about the bend axis. To ensure that the display cover layer exhibits satisfactory impact resistance during drop events, corner portions of the display cover layer and other edge portions of the display cover layer may be provided with greater thickness relative to other portions of the display cover layer outside of the locally thinned portion.
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公开(公告)号：US20230198129A1
公开(公告)日：2023-06-22
申请号：US18109168
申请日：2023-02-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , H04M1/0283 , H04M1/0249 , G06F1/1656 , B29C45/14311 , B29C45/14467 , G06F1/1626 , G06F1/1633 , B29L2031/34
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US11670210B2
公开(公告)日：2023-06-06
申请号：US17840890
申请日：2022-06-15
Applicant: Apple Inc.
Inventor： Ying-Chih Wang , Michael J. Brown , Michael B. Wittenberg , Paul C. Kelley , Rasamy Phouthavong , Tyler R. Kakuda , Jean-Pierre S. Guillou , Marwan Rammah
CPC classification number: G09G3/20 , G02B6/0006 , G02B6/0008 , G02B2006/12111 , G09F9/301
Abstract: An electronic device may have a display with pixels configured to display an image. The pixels may be overlapped by a cover layer. The display may have peripheral edges with curved cross-sectional profiles. An inactive area in the display may be formed along a peripheral edge of the display or may be surrounded by the pixels. Electrical components such as optical components may be located in the inactive area. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels, may have an opening that overlaps portions of the inactive area, may have an output surface that overlap portions of the inactive area, and/or may convey light associated with optical components in the electronic device.
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公开(公告)号：US20230168635A1
公开(公告)日：2023-06-01
申请号：US18097160
申请日：2023-01-13
Applicant: Apple Inc.
Inventor： Daniel J. Hiemstra , Erik G. de Jong , Kevin F. Holz , Michael B. Wittenberg , Timothy D. Koch
CPC classification number: G04G21/025 , A61B5/681 , A61B5/02438 , G04G17/08
Abstract: A modular sensing assembly may be used to detect user inputs at an electronic device. Example user inputs include touch inputs, fingerprint inputs, translational inputs, audio inputs, biometric inputs, and the like. Inputs received using the modular sensing assembly may be used to control a graphical output of a display of the electronic device. A modular sensing assembly may be configured, for example, as a power button, a key of a keyboard, a control button (e.g., volume control), a home button, a watch crown, and so on.
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公开(公告)号：US20230068455A1
公开(公告)日：2023-03-02
申请号：US18054283
申请日：2022-11-10
Applicant: Apple Inc.
Inventor： Riley E. Brandt , Richard H. Koch , Zhipeng Zhang , John C. DiFonzo , Michael B. Wittenberg
Abstract: An electronic device includes an enclosure and a keyboard positioned within the enclosure. The keyboard includes a substrate and a key mechanism. The key mechanism includes a keycap support mechanism, a keycap supported by the keycap support mechanism and movable relative to the substrate, a ferromagnetic component attached to the keycap support mechanism, and a selectively magnetizable magnet. The selectively magnetizable magnet system may include a magnetizable material and a coil configured to selectively magnetize and demagnetize the magnetizable material. The key mechanism may include a collapsible dome biasing the keycap toward the extended position.
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