公开(公告)号：US11272279B1

公开(公告)日：2022-03-08

申请号：US17023231

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Daniel R. Bloom

IPC: H04R1/00 ,  H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US11259107B2

公开(公告)日：2022-02-22

申请号：US16878561

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Mike B. Minerbi ,  Edward Siahaan ,  Benjamin A. Shaffer ,  Eugene A. Whang ,  Miikka O. Tikander ,  Derek W. Wright ,  Jared M. Kole ,  Esge B. Andersen ,  Daniel R. Bloom ,  Edwin J. Corona Aparicio ,  Timon A. Wright

IPC: H04R5/04 ,  H04R1/10 ,  H04R5/033 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11184695B2

公开(公告)日：2021-11-23

申请号：US16362386

申请日：2019-03-22

Applicant: Apple Inc.

Inventor： Daniel R. Bloom

IPC: H04R1/10 ,  H04R5/033 ,  H04R3/04 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11134327B2

公开(公告)日：2021-09-28

申请号：US16878536

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jason J. LeBlanc ,  Daniel R. Bloom ,  Edward Siahaan ,  Phillip Qian ,  Lee M. Panecki ,  Eugene Antony Whang ,  Jared M. Kole ,  Audrey L. Sheng ,  Tian Shi Li

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20190230427A1

公开(公告)日：2019-07-25

申请号：US16335846

申请日：2017-09-22

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Christopher J. Stringer ,  Daniel R. Bloom ,  Michael E. Leclerc ,  David H. Narajowski ,  Kristopher P. Laurent ,  Daniele de Iuliis ,  Markus Diebel ,  Sung-Ho Tan

IPC: H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20240348960A1

公开(公告)日：2024-10-17

申请号：US18629801

申请日：2024-04-08

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Lee M. Panecki ,  Phillip Qian ,  Benjamin A. Shaffer ,  Christopher J. Stringer ,  Eugene A. Whang ,  David H. Narajowski ,  Scott Y. Oshita ,  Dustin A. Hatfield ,  Zachary G. Segraves ,  Sean J. Docherty

IPC: H04R1/10 ,  H04R5/033

CPC classification number: H04R1/1008 ,  H04R1/1066 ,  H04R1/1075 ,  H04R5/0335

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11985462B2

公开(公告)日：2024-05-14

申请号：US17878767

申请日：2022-08-01

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Lee M. Panecki ,  Phillip Qian ,  Benjamin A. Shaffer ,  Christopher J. Stringer ,  Eugene A. Whang ,  David H. Narajowski ,  Scott Y. Oshita ,  Dustin A. Hatfield ,  Zachary G. Segraves ,  Sean J. Docherty

IPC: H04R1/10 ,  H04R5/033

CPC classification number: H04R1/1008 ,  H04R1/1066 ,  H04R1/1075 ,  H04R5/0335

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11700471B2

公开(公告)日：2023-07-11

申请号：US17804274

申请日：2022-05-26

Applicant: Apple Inc.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

CPC classification number: H04R1/1008 ,  H04R1/105 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/1066 ,  H04R1/1075 ,  H04R1/1083 ,  H04R5/0335 ,  H04R5/04 ,  G10K11/17861 ,  G10K11/17873

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20220386009A1

公开(公告)日：2022-12-01

申请号：US17804274

申请日：2022-05-26

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11457300B2

公开(公告)日：2022-09-27

申请号：US17023239

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Michael B. Minerbi ,  Eugene Antony Whang ,  Benjamin A. Shaffer ,  Edward Siahaan ,  Daniel R. Bloom

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.