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    AUDIO-VIDEO SERVER SYSTEM
    21.
    发明申请
    AUDIO-VIDEO SERVER SYSTEM 审中-公开
    音视频服务器系统

    公开(公告)号：US20160112766A1

    公开(公告)日：2016-04-21

    申请号：US14977649

    申请日：2015-12-22

    Applicant: Tatung Company

    Inventor： Chung-Chi Chang ,  I-Cheng He ,  Kuang-Min Hsu ,  Hao-Yu Chen

    IPC: H04N21/482 ,  H04N21/61 ,  H04N21/462 ,  H04N21/2668 ,  H04N21/81 ,  H04N21/858

    CPC classification number: H04N21/482 ,  H04N21/2668 ,  H04N21/4622 ,  H04N21/6125 ,  H04N21/8113 ,  H04N21/8173 ,  H04N21/858

    Abstract: A channelization method of digital content and an audio-video server system are provided. A received operational behavior is packaged as an execution module, and the execution module is associated with a channel number. A correlation between the channel number and the execution module is recorded in a local channel list. Accordingly, when a switch command that contains the channel number is received, the execution module corresponding to the channel number is obtained from the local channel list, so as to perform the operational behavior to use the digital content.

    Abstract translation: 提供数字内容和音视频服务器系统的信道化方法。 接收的操作行为被打包为执行模块，并且执行模块与通道号相关联。 通道号和执行模块之间的相关性记录在本地通道列表中。 因此，当接收到包含频道号的切换命令时，从本地频道列表中获得与频道号对应的执行模块，以便执行使用数字内容的操作行为。

    ANTIREFLECTION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
    23.
    发明申请
    ANTIREFLECTION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
    抗反射基板结构及其制造方法

    公开(公告)号：US20160079449A1

    公开(公告)日：2016-03-17

    申请号：US14949897

    申请日：2015-11-24

    Applicant: TATUNG UNIVERSITY ,  Tatung Company

    Inventor： Chiung-Wei Lin ,  Jheng-Jie Ruan ,  Yi-Liang Chen ,  Hsien-Chieh Lin

    IPC: H01L31/0216 ,  H01L31/0236

    CPC classification number: H01L31/02168 ,  H01L31/0216 ,  H01L31/0236 ,  H01L31/02363 ,  Y02E10/50

    Abstract: A manufacturing method of antireflection substrate structure includes: providing a silicon wafer having a first rough surface; forming an antireflection optical film on the silicon wafer, wherein the antireflection optical film conformally overlays the first rough surface; performing a surface treatment on the antireflection optical film so that the antireflection optical film has a hydrophilic surface, and the hydrophilic surface is relatively far away from the silicon wafer; dropping a colloidal solution on the hydrophilic surface of the antireflection optical film, wherein the colloidal solution includes a solution and multiple nano-balls and the nano-balls are adhered onto the hydrophilic surface; and performing an etching process on the hydrophilic surface of the antireflection optical film by taking the nano-balls as an etching mask so as to form a second rough surface, wherein the roughness of the second rough surface is different from the roughness of the first rough surface.

    Abstract translation: 防反射衬底结构的制造方法包括：提供具有第一粗糙表面的硅晶片; 在硅晶片上形成抗反射光学膜，其中防反射光学膜共形地覆盖第一粗糙表面; 对抗反射光学膜进行表面处理，使得防反射光学膜具有亲水性表面，亲水表面相对远离硅晶片; 将胶体溶液滴在防反射光学膜的亲水表面上，其中胶体溶液包括溶液和多个纳米球，并且纳米球粘附到亲水表面上; 并且通过以纳米球作为蚀刻掩模对抗反射光学膜的亲水表面进行蚀刻处理，以形成第二粗糙表面，其中第二粗糙表面的粗糙度与第一粗糙面的粗糙度不同 表面。

    ELECTRONIC ASSEMBLY
    24.
    发明申请
    ELECTRONIC ASSEMBLY 审中-公开
    电子总成

    公开(公告)号：US20150216084A1

    公开(公告)日：2015-07-30

    申请号：US14445071

    申请日：2014-07-29

    Applicant: Tatung Company

    Inventor： Chih-Wen Huang

    IPC: H05K7/20

    CPC classification number: H01L23/3677 ,  H01L23/3735 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/1434

    Abstract: An electronic assembly includes a heat generating element, a heat dissipation fin set disposed above the heat generating element, a filter circuit board, and a heat conducting layer. The filter circuit board is located between the heat generating element and the heat dissipation fin set, and includes a metal layer, an electromagnetic band gap structure layer, and an insulation layer. The metal layer has a first opening and contacts the heat dissipation fin set. The electromagnetic band gap structure layer has conductive patterns. Thermal vias pass through the insulation layer and connect to the metal layer. The heat generating element contacts the conductive patterns. The insulating layer is disposed between the metal layer and the electromagnetic band gap structure layer, and has a second opening and a peripheral region aligned to the conductive patterns. The heat conducting layer contacts the heat dissipation fin set through the first and second openings.

    Abstract translation: 电子组件包括发热元件，设置在发热元件上方的散热翅片组，过滤器电路板和导热层。 滤波器电路板位于发热元件和散热片组之间，包括金属层，电磁带隙结构层和绝缘层。 金属层具有第一开口并与散热片组接触。 电磁带隙结构层具有导电图案。 热通孔穿过绝缘层并连接到金属层。 发热元件接触导电图案。 绝缘层设置在金属层和电磁带隙结构层之间，并且具有与导电图案对准的第二开口和周边区域。 导热层接触通过第一和第二开口设置的散热片。

    DRESSING STRUCTURE
    25.
    发明申请
    DRESSING STRUCTURE 审中-公开
    连结结构

    公开(公告)号：US20150051531A1

    公开(公告)日：2015-02-19

    申请号：US14149811

    申请日：2014-01-08

    Applicant: Tatung Company

    Inventor： Cheng-Yang Lee

    IPC: A61F13/02

    CPC classification number: A61F13/0243

    Abstract: A dressing structure comprising a composite substrate layer and a gel layer is provided. The composite substrate layer comprises a first substrate layer and a second substrate layer. The first substrate layer comprises a plurality of first pores. The second substrate layer comprises a plurality of second pores. The second substrate layer and the first substrate layer are flat and unwrinkled. The gel layer is at least disposed between the first substrate layer and the second substrate layer.

    Abstract translation: 提供包括复合衬底层和凝胶层的敷料结构。 复合衬底层包括第一衬底层和第二衬底层。 第一基底层包括多个第一孔。 第二基底层包括多个第二孔。 第二基板层和第一基板层平坦且不折皱。 凝胶层至少设置在第一基底层和第二基底层之间。

    ANTIREFLECTION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
    26.
    发明申请
    ANTIREFLECTION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    抗反射基板结构及其制造方法

    公开(公告)号：US20140159187A1

    公开(公告)日：2014-06-12

    申请号：US13761158

    申请日：2013-02-07

    Applicant: TATUNG COMPANY ,  TATUNG UNIVERSITY

    Inventor： Chiung-Wei Lin ,  Jheng-Jie Ruan ,  Yi-Liang Chen ,  Hsien-Chieh Lin

    IPC: H01L31/02 ,  H01L31/18

    CPC classification number: H01L31/02168 ,  H01L31/0216 ,  H01L31/0236 ,  H01L31/02363 ,  Y02E10/50

    Abstract: A manufacturing method of antireflection substrate structure includes: providing a silicon wafer having a first rough surface; forming an antireflection optical film on the silicon wafer, wherein the antireflection optical film conformally overlays the first rough surface; performing a surface treatment on the antireflection optical film so that the antireflection optical film has a hydrophilic surface, and the hydrophilic surface is relatively far away from the silicon wafer; dropping a colloidal solution on the hydrophilic surface of the antireflection optical film, wherein the colloidal solution includes a solution and multiple nano-balls and the nano-balls are adhered onto the hydrophilic surface; and performing an etching process on the hydrophilic surface of the antireflection optical film by taking the nano-balls as an etching mask so as to form a second rough surface, wherein the roughness of the second rough surface is different from the roughness of the first rough surface.

    Abstract translation: 防反射衬底结构的制造方法包括：提供具有第一粗糙表面的硅晶片; 在硅晶片上形成抗反射光学膜，其中防反射光学膜共形地覆盖第一粗糙表面; 对抗反射光学膜进行表面处理，使得防反射光学膜具有亲水性表面，亲水表面相对远离硅晶片; 将胶体溶液滴在防反射光学膜的亲水表面上，其中胶体溶液包括溶液和多个纳米球，并且纳米球粘附到亲水表面上; 并且通过以纳米球作为蚀刻掩模对抗反射光学膜的亲水表面进行蚀刻处理，以形成第二粗糙表面，其中第二粗糙表面的粗糙度与第一粗糙面的粗糙度不同 表面。

    FINGER TYPE ANTENNA
    28.
    发明申请
    FINGER TYPE ANTENNA 审中-公开

    公开(公告)号：US20200176869A1

    公开(公告)日：2020-06-04

    申请号：US16449481

    申请日：2019-06-24

    Applicant: Tatung Company ,  TATUNG UNIVERSITY

    Inventor： Chi-Fang Huang ,  Ruei-Bo Chiou ,  Chih-Jou Lin

    IPC: H01Q5/335 ,  H01Q9/42 ,  H01Q1/38 ,  H01Q9/30

    Abstract: The disclosure provides a finger type antenna, including a short-circuit portion, a feeding portion, an open-circuit portion, a ground portion, and a coplanar waveguide. The short-circuit portion has a first end and a second end. The feeding portion has a first end and a second end, wherein the first end of the feeding portion is coupled to the first end of the short-circuit portion. The open-circuit portion includes at least three antenna elements, wherein each antenna element has a first end and a second end, and the first ends of the antenna elements are coupled to each other via the feeding portion. The coplanar waveguide is connected to the second end of the short-circuit portion, the second end of the feeding portion, and the ground portion.

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