公开(公告)号：US20080038916A1

公开(公告)日：2008-02-14

申请号：US11779794

申请日：2007-07-18

申请人： Xavier Rottenberg ,  Phillip Ekkels ,  Hendrikus Tilmans ,  Walter De Raedt

发明人： Xavier Rottenberg ,  Phillip Ekkels ,  Hendrikus Tilmans ,  Walter De Raedt

IPC分类号： H01L21/4763 ,  H01L21/311

CPC分类号： B81C1/00611 ,  B81B2201/0271 ,  B81C2201/0123

摘要： A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in between the plurality of structures. The method further comprises providing a fill layer of electromagnetic radiation curable material substantially filling the space between the structures. The method further comprises illuminating a portion of the fill layer with electromagnetic radiation, hereby producing a exposed portion and an unexposed portion, the portions being separated by an interface substantially parallel with the first main surface of the substrate. The method further comprises removing the portion above the interface.

摘要翻译： 公开了一种制造平面结构的方法。 该方法包括在基板上制造具有大致相同高度的多个结构，并且在多个结构之间存在空间。 该方法还包括提供基本上填充结构之间的空间的电磁辐射可固化材料的填充层。 该方法还包括用电磁辐射照射填充层的一部分，从而产生暴露部分和未曝光部分，该部分被基本平行于基底的第一主表面的界面分开。 该方法还包括去除界面上方的部分。

公开(公告)号：US06876056B2

公开(公告)日：2005-04-05

申请号：US10127341

申请日：2002-04-18

申请人： Hendrikus Tilmans ,  Eric Beyne ,  Henri Jansen ,  Walter De Raedt

发明人： Hendrikus Tilmans ,  Eric Beyne ,  Henri Jansen ,  Walter De Raedt

IPC分类号： H01H59/00 ,  H01L21/84 ,  H01L27/12 ,  H01P1/12 ,  H01L27/00 ,  H09F5/00

CPC分类号： B81B7/0006 ,  H01H59/0009 ,  H01L21/84 ,  H01L27/12 ,  H01P1/127

摘要： An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.

摘要翻译： 描述了一种互连模块及其制造方法，包括：衬底，形成在衬底上的互连部分和形成在位于横向相邻于互连部分的衬底上的可变无源器件部分。 互连部分具有由电介质层隔开的至少两个金属互连层，并且可变无源器件具有至少一个可移动元件。 可移动元件由金属层形成，该金属层由相同的材料形成，并且与两个互连层之一形成同时。 可移动元件形成在电介质层上，并通过局部去除电介质层而释放。 可以添加附加的互连层和中间介电层。