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    Electronic Device Antenna Structures With Ferrite Layers
    233.
    发明申请
    Electronic Device Antenna Structures With Ferrite Layers 审中-公开

    公开(公告)号：US20160218432A1

    公开(公告)日：2016-07-28

    申请号：US15004803

    申请日：2016-01-22

    Applicant: Apple Inc.

    Inventor： Benjamin J. Pope ,  Scott A. Myers ,  Mattia Pascolini

    IPC: H01Q7/06 ,  H04B5/00

    CPC classification number: H01Q7/06 ,  H01Q1/243 ,  H01Q1/526 ,  H04B5/0081 ,  Y10T29/49016

    Abstract: Electronic devices may be provided that have antenna traces. The antenna traces may be configured to form an inductive loop that serves as a near field communications antenna. A layer of ferrite may be provided to reduce interference between the antenna and internal device components. The layer of ferrite and the antenna traces may be deposited on a common substrate such as a layer of polymer or a dielectric electronic device housing. A protective layer of polymer may be used to form a coating on the layer of ferrite. Ferrite may be formed on the same side of a substrate as the antenna traces or may be formed on an opposing side of the substrate.

    Field shaping channels in a substrate above a biometric sensing device
    234.
    发明授权
    Field shaping channels in a substrate above a biometric sensing device 有权
    在生物测定装置上方的衬底中的场成形通道

    公开(公告)号：US09342727B2

    公开(公告)日：2016-05-17

    申请号：US14196832

    申请日：2014-03-04

    Applicant: APPLE INC.

    Inventor： Sawyer I. Cohen ,  Scott A. Myers ,  Dale N. Memering

    IPC: G06K9/00

    CPC classification number: G06K9/0002 ,  G06K9/00053

    Abstract: An electronic device may include a biometric sensing device that has a sensing area, and a substrate positioned above the sensing area and/or the biometric sensing device. The substrate can include vias that are formed through at least a portion of the substrate. The vias can be positioned at least above the sensing area of the biometric sensing device. The vias may be filled with a conductive material or a dielectric material. Alternatively, some vias can be filled with a conductive material while other vias are filled with a non-conductive or dielectric material.

    Abstract translation: 电子设备可以包括具有感测区域的生物特征感测装置和位于感测区域上方的基板和/或生物测定传感装置。 衬底可以包括通过衬底的至少一部分形成的通孔。 通孔可以至少位于生物测定装置的感测区域的上方。 通孔可以用导电材料或电介质材料填充。 或者，可以用导电材料填充一些通孔，而其它通孔用非导电或电介质材料填充。

    Pull tab design for stretch release adhesive
    235.
    发明授权
    Pull tab design for stretch release adhesive 有权
    拉伸片设计用于拉伸剥离粘合剂

    公开(公告)号：US09333706B2

    公开(公告)日：2016-05-10

    申请号：US14254809

    申请日：2014-04-16

    Applicant: Apple Inc.

    Inventor： Stefan C. Mag ,  Matthew D. Hill ,  Scott A. Myers ,  Liane J. Fang ,  Tyler B. Cater

    IPC: C09J7/02 ,  B29C65/50 ,  B29C65/76 ,  C09J7/00 ,  H04M1/02 ,  F16B11/00

    CPC classification number: B29C65/76 ,  B29C65/50 ,  B29C65/5057 ,  B29L2031/3481 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/618 ,  C09J2203/326 ,  C09J2203/33 ,  C09J2421/00 ,  F16B11/006 ,  G06F1/1613 ,  H04M1/026 ,  H04M1/0262 ,  H04M1/0279 ,  H05K5/0086 ,  Y10T428/1476 ,  Y10T428/2419 ,  Y10T428/24273 ,  Y10T428/24777

    Abstract: A stretch release adhesive is disclosed. The stretch release adhesive can be used for extracting an electrical component from an interior surface of a housing of a mobile computing device. The stretch release adhesive can have a double-sided adhesive body configured to adhere the component to the interior surface of the housing. A portion of the double-sided adhesive body is configured to extend out from between the electrical component and the interior surface of the housing to provide a graspable portion. When the stretch release adhesive is adhered between the electrical component and the internal surface of the housing, the stretch release adhesive can receive a pulling force at the graspable portion. If pulled with enough force, the stretch release adhesive will extend outwardly from between the electrical component and the internal surface of the mobile computing device, then completely release the electrical component from the mobile computing device.

    Abstract translation: 公开了一种拉伸剥离粘合剂。 拉伸剥离粘合剂可用于从移动计算设备的壳体的内表面提取电气部件。 拉伸剥离粘合剂可以具有双面粘合体，其构造成将部件粘附到壳体的内表面。 双面粘合体的一部分构造成从电气部件和壳体的内表面之间延伸出来，以提供可抓握部分。 当拉伸剥离粘合剂粘附在电气部件和壳体的内表面之间时，拉伸剥离粘合剂可以在可抓握部分处受到拉力。 如果用足够的力拉动，则拉伸剥离粘合剂将从电气部件和移动计算设备的内表面之间向外延伸，然后从移动计算设备完全释放电气部件。

    BUTTON FEATURES OF AN ELECTRONIC DEVICE
    236.
    发明申请
    BUTTON FEATURES OF AN ELECTRONIC DEVICE 有权
    电子设备的按钮特征

    公开(公告)号：US20160071664A1

    公开(公告)日：2016-03-10

    申请号：US14553985

    申请日：2014-11-25

    Applicant: Apple Inc.

    Inventor： Sawyer I. Cohen ,  Tyler B. Cater ,  Marwan Rammah ,  Yaocheng Zhang ,  Edward S. Huo ,  Dhaval N. Shah ,  Scott A. Myers ,  Vivek Katiyar

    IPC: H01H13/50

    CPC classification number: H01H13/705 ,  H01H13/52 ,  H01H2221/062 ,  H01H2221/064 ,  H01H2221/08

    Abstract: Systems and methods for forming button assemblies for electronic devices are disclosed. According to some embodiments, the button assemblies include one or more sound improvement features to improve the sound that the button assemblies make when pressed by users of the electronic devices. According to some embodiments, the button assemblies include shims that provide proper alignment of the various components of the button assemblies and to accommodate any tolerance stack up of the various components of the button assemblies. The shims can include alignment features to prevent the shims from shifting within the button assemblies. According to some embodiments, thicknesses of the shims are customized to accommodate varying tolerance stack ups of the components of the button assemblies. In some embodiments, the button assemblies include a combination of sound improvement features and shims.

    Abstract translation: 公开了用于形成用于电子设备的按钮组件的系统和方法。 根据一些实施例，按钮组件包括一个或多个声音改进特征，以在根据电子设备的用户按压时改善按钮组件所产生的声音。 根据一些实施例，按钮组件包括提供按钮组件的各种部件的适当对准并且适应按钮组件的各种部件的任何公差叠加的垫片。 垫片可以包括对准特征，以防止垫片在按钮组件内移动。 根据一些实施例，垫片的厚度被定制以适应按钮组件的部件的不同公差叠加。 在一些实施例中，按钮组件包括声音改进特征和垫片的组合。

    Display with Vias for Concealed Printed Circuit and Component Attachment
    237.
    发明申请
    Display with Vias for Concealed Printed Circuit and Component Attachment 审中-公开

    公开(公告)号：US20160021746A1

    公开(公告)日：2016-01-21

    申请号：US14866494

    申请日：2015-09-25

    Applicant: Apple Inc.

    Inventor： Derek Wright ,  Fletcher R. Rothkopf ,  Scott A. Myers

    IPC: H05K1/11

    CPC classification number: G09G3/3208 ,  G09G2300/0426 ,  H01L27/3276 ,  H01L51/52 ,  H05K1/115

    Abstract: An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. Components such as flexible printed circuits, integrated circuits, connectors, and other circuitry may be mounted to the contacts on the rear surface of the display.

    FIELD SHAPING CHANNELS IN A SUBSTRATE ABOVE A BIOMETRIC SENSING DEVICE
    238.
    发明申请
    FIELD SHAPING CHANNELS IN A SUBSTRATE ABOVE A BIOMETRIC SENSING DEVICE 有权
    生物传感装置中的基底中的场形成通道

    公开(公告)号：US20150254490A1

    公开(公告)日：2015-09-10

    申请号：US14196832

    申请日：2014-03-04

    Applicant: APPLE INC.

    Inventor： Sawyer I. Cohen ,  Scott A. Myers ,  Dale N. Memering

    IPC: G06K9/00

    CPC classification number: G06K9/0002 ,  G06K9/00053

    Abstract: An electronic device may include a biometric sensing device that has a sensing area, and a substrate positioned above the sensing area and/or the biometric sensing device. The substrate can include vias that are formed through at least a portion of the substrate. The vias can be positioned at least above the sensing area of the biometric sensing device. The vias may be filled with a conductive material or a dielectric material. Alternatively, some vias can be filled with a conductive material while other vias are filled with a non-conductive or dielectric material.

    Abstract translation: 电子设备可以包括具有感测区域的生物特征感测装置和位于感测区域上方的基板和/或生物测定传感装置。 衬底可以包括通过衬底的至少一部分形成的通孔。 通孔可以至少位于生物测定装置的感测区域的上方。 通孔可以用导电材料或电介质材料填充。 或者，可以用导电材料填充一些通孔，而其它通孔用非导电或电介质材料填充。

    ANTENNA ON SAPPHIRE STRUCTURE
    239.
    发明申请
    ANTENNA ON SAPPHIRE STRUCTURE 有权
    天花板上的蓝宝石结构

    公开(公告)号：US20150229018A1

    公开(公告)日：2015-08-13

    申请号：US14178623

    申请日：2014-02-12

    Applicant: Apple Inc.

    Inventor： Benjamin J. Pope ,  Scott A. Myers

    IPC: H01Q1/24 ,  H01Q1/38

    CPC classification number: H01Q1/38 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q3/26 ,  H01Q3/44 ,  H01Q7/00 ,  H05K3/10 ,  Y10T29/49016

    Abstract: An antenna on a sapphire structure. The antenna includes a sapphire structure having a first side, and a second side positioned opposite the first side. The antenna also includes a first antenna trace positioned on the first side of the sapphire structure, and a second antenna trace positioned on the second side of the sapphire structure. Additionally, the antenna includes at least one via formed through the sapphire structure. The at least one via electrically connects the first antenna trace to the second antenna trace.

    Abstract translation: 蓝宝石结构天线。 天线包括具有第一侧的蓝宝石结构和与第一侧相对的第二侧。 天线还包括位于蓝宝石结构的第一侧上的第一天线迹线和位于蓝宝石结构的第二侧上的第二天线迹线。 此外，天线包括至少一个通过蓝宝石结构形成的通孔。 所述至少一个通孔将所述第一天线迹线电连接到所述第二天线迹线。

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