摘要:
An ultrasound sensor includes: a diaphragm; a plurality of first electrodes; a plurality of second electrodes; and a plurality of piezoelectric layers which is provided between the first electrode and the second electrode, in which, in a Z-direction, a portion in which the first electrode, the piezoelectric layer and the second electrode are overlapped is referred to as an active portion, and a range to the extent that the diaphragm is oscillatable by driving the active portion is referred to as a movable portion, when a unit including one movable portion and the active portion which is provided within the one movable portion is referred to as one ultrasound element in plan view, two or more types of ultrasound elements in which a dimension of the active portion with respect to a dimension of the movable portion is different from each other in plan view are provided.
摘要:
A method for fabricating a piezoelectric transducer is provided. The method includes providing a substrate on which a plurality of patterned electrodes are formed; providing a piezoelectric suspension, having a plurality of piezoelectric particles, on the substrate and the plurality of patterned electrodes; applying a voltage between the plurality of patterned electrodes to produce an electric field; and depositing the plurality of piezoelectric particles of the piezoelectric suspension on at least one of the plurality of patterned electrodes by the electric field to form a patterned piezoelectric membrane, and polarizing the piezoelectric membrane by the electric field.
摘要:
An acoustic generator disclosed herein includes: an exciter which vibrates by an electric signal being input; and a film-shaped vibrating body to which the exciter is bonded via a bonding material and which vibrates together with the exciter by the vibration of the exciter, wherein the bonding material has a protruded part which protrudes from an outer edge of the exciter when the vibrating body is viewed in plane, at least a part of the protruded part has an undulating shape so as to be different from a shape of the outer edge of the exciter, and a part without the bonding material is provided between the exciter and the vibration body.
摘要:
Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
摘要:
A oscillator device includes: a first substrate that has a first surface, a second surface, and a through hole extending between the first surface and the second surface; a crystal oscillator that is disposed on the first surface of the first substrate, the crystal oscillator including an electrode; a second substrate that is disposed on the crystal oscillator; a through electrode that is disposed in the through hole, that has a diameter smaller than a diameter of the through hole, that is electrically coupled to the electrode, and that extends between the first surface and the second surface; and a filling member with which an area between an inner wall of the through hole and the through electrode is filled.
摘要:
A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical feedthrough is formed in the support which allows electrical contacting of the MEMS component through the support. To achieve the largest possible rear volume for the diaphragm structure of the MEMS component for a given chip surface area, and also to simplify the processing of the support, according to the invention the electrical feedthroughs are integrated into the wall of the cavity adjoining the diaphragm structure, in that at least one section of such a feedthrough is implemented in the form of an electrically conductive coating of a side wall section of the cavity.
摘要:
A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a multilayer stack disposed on a substrate. The multilayer stack may include an anchor structure disposed over the substrate, a piezoelectric layer stack disposed over the anchor structure, and a mechanical layer disposed proximate to the piezoelectric layer stack. The piezoelectric layer stack may be disposed over a cavity. The mechanical layer may seal the cavity and, together with the piezoelectric layer stack, is supported by the anchor structure and forms a membrane over the cavity, the membrane being configured to undergo one or both of flexural motion and vibration when the PMUT receives or transmits ultrasonic signals.
摘要:
An electromechanical transducer includes a first electrode mounted on one of a substrate and a base film, an electromechanical transducer film mounted on the first electrode and made of a piezoelectric substance having a perovskite crystal structure, and a second electrode mounted on the electromechanical transducer film. The electromechanical transducer film includes a {100} plane preferentially oriented to be orthogonal to a thickness direction of the electromechanical transducer film and has a full width at half maximum corresponding to a {200} plane in an X-ray diffraction measurement curve in 2θ-ω scan that is measured by emitting an X-ray beam onto a surface of the electromechanical transducer film at an incident angle θ. The full width at half maximum is not greater than 10 degrees.
摘要:
Highly deformable heterostructures utilizing liquid metals and nanostructures that are suitable for various applications, including but not limited to stretchable electronic devices that can be worn, for example, by a human being. Such a deformable heterostructure includes a stretchable substrate, a conductive liquid metal on the substrate, and nanostructures forming a solid-liquid heterojunction with the conductive liquid metal.
摘要:
A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. The ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.