-
公开(公告)号：US20180106949A1
公开(公告)日：2018-04-19
申请号：US15109127
申请日：2016-05-25
IPC: F21V8/00
CPC classification number: G02B6/0053 , G02B6/0051 , G02B6/0055 , G02B6/0065 , G02B6/0088
Abstract: The present invention provides a backlight module and a liquid crystal display device. The backlight module of the present invention includes an upper brightness enhancement film (7), which includes a central zone (71) and a lens zone (72) located between the central zone (71) and a mold frame (1). The upper brightness enhancement film (7) includes a prism structure formed on an upper surface of the central zone (71); and the upper brightness enhancement film (7) includes a lens structure formed on an upper surface of the lens zone (72). The lens structure includes a plurality of concave surfaces (721) arranged in sequence in a side-by-side manner from an edge of the upper brightness enhancement film (7) toward interior thereof. The prism structure and the lens structure of the upper brightness enhancement film (7) are integrally formed together. The lens structure of the upper brightness enhancement film (7) helps diverge light projecting outward so as to have a part of the light extending over and covering a portion of an area shielded by the light-shielding tape (8), expanding a view area of the backlight module to thereby achieving a visual effect of narrowing bezel. Further, the manufacturing process is simplified, the manufacturing cost is reduced, and product yield is increased.
-
公开(公告)号：US11206733B2
公开(公告)日：2021-12-21
申请号：US16471995
申请日：2019-03-14
Inventor： Yan Cheng
Abstract: A display panel and a bezel substrate thereof are disclosed. The bezel substrate includes a bending section and a plurality of wirings. Each of the wirings includes a first line section and a second line section, the first line section and the second line section are disposed on the bending section, a width of the first line section to each of the wirings is greater than a width of the second line section of the wirings, and the first line sections of the adjacent wirings are staggered with respect to each other.
-
公开(公告)号：US10359557B2
公开(公告)日：2019-07-23
申请号：US15533023
申请日：2017-05-25
Inventor： Yan Cheng
IPC: F21V8/00
Abstract: The present disclosure relates to a light guide plate and a backlight module thereof, wherein the light guide plate includes: a light incident surface, a transmission layer, and a light emission surface. Wherein a light waveguide layer is configured within the transmission layer to change a transmission direction of at least a portion of light beams entered from the light incident surface along a direction perpendicular to the light emission surface. At least one periodic microstructure is configured on the light emission surface. The present disclosure may improve convergence characteristics of the light beams entered the light guide plate and may reduce the crosstalk between areas.
-
公开(公告)号：US10185074B2
公开(公告)日：2019-01-22
申请号：US15112525
申请日：2016-06-21
Inventor： Yan Cheng , Shih-hsiang Chen , Mei Han
IPC: F21V7/04 , F21V8/00 , G02F1/13357 , G02F1/1368 , G02F1/1362 , G02F1/1335
Abstract: The present invention provides a backlight module used in liquid crystal displays. The backlight module includes a quantum dots film, a light guide plate and a light source module. A light is emitted from the light source module enter into the quantum dots film through the light guide plate. The quantum dots film comprises an active region and an inactive region. The light source module includes a blue light source and a green light source. The blue light source is corresponding to the active region, and the green light source is corresponding to the inactive region. The present invention further provides a backlight module used in liquid crystal displays. The present invention provides a backlight module and quantum dots film of liquid crystal display which can resolve a defect of quantum dots film fails in the cutting position, and the quantum dots film has high color gamut conversion.
-
公开(公告)号：US09841547B2
公开(公告)日：2017-12-12
申请号：US14905788
申请日：2015-09-09
Inventor： Yan Cheng
IPC: F21V8/00
CPC classification number: G02B6/0026 , G02B6/0055
Abstract: The present invention discloses a backlight module and a liquid crystal device (LCD). The backlight module includes a LED component, a light guiding plate, a quantum dot (QD) layer, and a graphite sheet. The QD layer is arranged between the LED component and the light guiding plate, and the QD layer is arranged on the graphite sheet. By configuring the QD layer on the graphite sheet, the QD layer is prevented from being failed due to high temperature so as to extend the life cycle of the QD layer. Thus, the display performance may be enhanced.
-
Patent Agency Ranking
公开(公告)号：US20170287412A1
公开(公告)日：2017-10-05
申请号：US15331247
申请日：2016-10-21
Inventor： Yan Cheng
CPC classification number: G09G3/3426 , G02B6/002 , G02B6/005 , G02B6/0055 , G02B6/0068 , G02B6/0073 , G09G3/3413 , G09G2320/0633 , G09G2320/0666
Abstract: An adjustable backlight module comprises an image data gathering device; a user data gathering device; a data analyzing device connected to the image data gathering device and the user data gathering device; a controller connected to the data analyzing device; and a LCD backlight source connected to the controller. Based on the user's demands on the image brightness and color gamut, the present invention utilizes a controller and its driving circuit to control the LED chips of two colors individually for adjusting on and off of the LED chips and the intensity of light, thereby adjusting the brightness and color gamut of the entire module, and thus carrying out effective real-time control of the brightness and color gamut.
-
公开(公告)号：US20170146718A1
公开(公告)日：2017-05-25
申请号：US14786049
申请日：2015-06-23
Inventor： Yan Cheng
IPC: F21V8/00
CPC classification number: G02B6/0026 , G02B6/00 , G02B6/0023
Abstract: A quantum dot backlight module is disclosed. The quantum dot backlight module comprises a light source; a quantum dot layer, which emits fluorescence after being excited by light that is emitted by the light source; and a light guide plate, which guides the fluorescence that is emitted by the quantum dot layer to a needed direction, wherein the quantum dot layer is arranged on a light-entering side of the light guide plate, and a colloid layer is arranged between the light source and the quantum dot layer so as to enable the light source and the quantum dot layer to be bonded with each other closely, whereby the light source, the quantum dot layer, and the light guide plate are assembled together. According to the present disclosure, the light transmission mode of the light source after entering into the light guide plate is changed through changing the structure of the quantum dot backlight module, so that the light loss thereof can be reduced, and the light-emitting efficiency of the backlight module can be improved.
-
公开(公告)号：US11086157B1
公开(公告)日：2021-08-10
申请号：US17049355
申请日：2020-08-24
Inventor： Wei Zhou , Gege Zhou , Chao Liang , Zhongjie Liu , Yan Cheng
IPC: G02F1/1333 , F21V8/00
Abstract: A display device is provided, which includes a middle frame, a first substrate, a second substrate, a cover plate, an ink layer, and a silicone glue. By providing a barrier block or a slot disposed on a side of the ink layer close to the first substrate, the barrier block is disposed between the silicone glue and a side frame to prevent the ink layer on the cover plate from spreading of a pollution source, so that a surface of the ink layer of a glass cover plate of a display module can meet dyne specification requirements. It also ensures an adhesive strength of the middle frame and the cover plate to prevent bonding failure.
-
公开(公告)号：US10509278B2
公开(公告)日：2019-12-17
申请号：US16009902
申请日：2018-06-15
IPC: G02F1/1345 , G02F1/1333 , H05K1/18 , H05K1/02
Abstract: The present disclosure relates to a chip on film (COF) single-layer flexible printed circuit board, including: a flexible packaging substrate including a bonding area and a controlling chip being packaged on the flexible packaging substrate. The bonding area of the flexible packaging substrate is configured to bond with a bonding area of an array substrate. The controlling chip electrically connects to the bonding area of the flexible packaging substrate. The controlling chip and the bonding area of the flexible packaging substrate are configured on the same side of the flexible packaging substrate, and a portion of the flexible packaging substrate is bent at least one time. As such, the controlling chip faces away the array substrate, the cost and the complexity of the post-process may be reduced, and the COF single-layer flexible printed circuit board may be shipped in the folding manner.
-
公开(公告)号：US20190004239A1
公开(公告)日：2019-01-03
申请号：US15567731
申请日：2017-07-25
IPC: F21V8/00
Abstract: The present disclosure discloses a backlight module including a light guide plate, an optical diaphragm group disposed on a light exiting surface of the light guide plate, and a backlight source disposed at a light incident end of the light guide plate, a middle frame, a radiating fin and a heat conducting connector. The middle frame is disposed on an outer surface of the backlight module and includes a bottom plate and a side wall. The radiating fin is attached to an internal surface of the bottom plate of the middle frame, and the heat conducting connector includes a first portion that contacts the backlight source and a second portion that only contacts a partial region of the radiating fin. The present disclosure also discloses a mobile terminal.
-
-
-
-
-
-
-
-
-
Search Results
22
records
(took 0.019 seconds)
