公开(公告)号：US10941034B1

公开(公告)日：2021-03-09

申请号：US16542479

申请日：2019-08-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng ,  Wen Cheng Kuo

IPC: B81C1/00 ,  B81B7/00

Abstract: Various embodiments of the present disclosure are directed towards a microphone including a particle filter disposed between a microelectromechanical systems (MEMS) substrate and a carrier substrate. A MEMS device structure overlies the MEMS substrate. The MEMS device structure includes a diaphragm having opposing sidewalls that define a diaphragm opening. The carrier substrate underlies the MEMS substrate. The carrier substrate has opposing sidewalls that define a carrier substrate opening underlying the diaphragm opening. A filter stack is sandwiched between the carrier substrate and the MEMS substrate. The filter stack includes an upper dielectric layer, a lower dielectric layer, and a particle filter layer disposed between the upper and lower dielectric layers. The particle filter layer includes the particle filter spaced laterally between the opposing sidewalls of the carrier substrate.