METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
    13.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    制造半导体发光器件的方法

    公开(公告)号:US20130316481A1

    公开(公告)日:2013-11-28

    申请号:US13846905

    申请日:2013-03-18

    CPC classification number: H01L33/0079

    Abstract: A method for manufacturing a semiconductor light emitting device is provided. The method includes forming a light emitting structure by sequentially growing a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a semiconductor growth substrate A support unit is disposed on the second conductivity-type semiconductor layer, so as to be combined with the light emitting structure. The semiconductor growth substrate is separated from the light emitting structure. An interface between the semiconductor growth substrate and a remaining light emitting structure is wet-etched such that the light emitting structure remaining on the separated semiconductor growth substrate is separated therefrom. The semiconductor growth substrate is cleaned.

    Abstract translation: 提供一种制造半导体发光器件的方法。 该方法包括通过在半导体生长衬底上顺序生长第一导电类型半导体层,有源层和第二导电类型半导体层来形成发光结构。支撑单元设置在第二导电型半导体层上, 以便与发光结构组合。 半导体生长衬底与发光结构分离。 湿式蚀刻半导体生长衬底和剩余的发光结构之间的界面,使得保留在分离的半导体生长衬底上的发光结构与其分离。 清洁半导体生长衬底。

    METHOD OF MANUFACTURING LIGHT EMITTING DEVICE
    14.
    发明申请
    METHOD OF MANUFACTURING LIGHT EMITTING DEVICE 有权
    制造发光装置的方法

    公开(公告)号:US20130244353A1

    公开(公告)日:2013-09-19

    申请号:US13844569

    申请日:2013-03-15

    CPC classification number: H01L33/005 H01L33/26

    Abstract: Provided a method of manufacturing a semiconductor light emitting device, the method includes forming a light emitting structure by growing a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer on a substrate. The forming of the light emitting structure includes: forming a protective layer after a portion of the light emitting structure is formed forming a sacrificial layer on the protective layer; and continuously forming a further portion of the light emitting structure on the sacrificial layer.

    Abstract translation: 提供一种制造半导体发光器件的方法,该方法包括通过在衬底上生长第一导电类型半导体层,有源层和第二导电类型半导体层来形成发光结构。 发光结构的形成包括:在形成发光结构的一部分之后形成保护层,在保护层上形成牺牲层; 并且在牺牲层上连续地形成发光结构的另一部分。

Patent Agency Ranking