公开(公告)号：US20240162111A1

公开(公告)日：2024-05-16

申请号：US18510056

申请日：2023-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghyun CHO ,  Jae-Min JUNG

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/538 ,  H01L25/11

CPC classification number: H01L23/3737 ,  H01L23/5383 ,  H01L23/5387 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/115 ,  H01L2224/14177 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73203

Abstract: A semiconductor package includes a flexible insulating substrate including a first surface and a second surface opposite to the first surface, a first wiring on the first surface of the flexible insulating substrate, a second wiring on the second surface of the flexible insulating substrate, a plurality of vias coupling the first wiring to the second wiring, a plurality of semiconductor devices on the first surface of the flexible insulating substrate, and a heat dissipation resin layer at least partially covering at least one semiconductor device of the plurality of semiconductor devices.

公开(公告)号：US20240288834A1

公开(公告)日：2024-08-29

申请号：US18624262

申请日：2024-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegyun KIM ,  Junghyun KANG ,  Kijung KIM ,  Shinhun MOON ,  Seunghyun CHO ,  Seongho HONG

IPC: G04G19/00 ,  A61B5/00 ,  A61B5/024 ,  G04G9/00 ,  G04G21/02 ,  H02J7/00 ,  H02J50/00 ,  H02J50/10 ,  H05K1/02 ,  H05K5/00

CPC classification number: G04G19/00 ,  G04G9/007 ,  G04G21/025 ,  H02J7/0042 ,  H02J50/005 ,  H05K1/028 ,  H05K5/0026 ,  A61B5/02416 ,  A61B5/681 ,  H02J50/10 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: An electronic device is disclosed, including a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.

公开(公告)号：US20230326930A1

公开(公告)日：2023-10-12

申请号：US18092241

申请日：2022-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghyun CHO ,  Jaemin JUNG

IPC: H01L27/12 ,  G09G3/20

CPC classification number: H01L27/124 ,  G09G3/2092 ,  G09G2300/0408

Abstract: A chip-on-film (COF) semiconductor package includes: a main film substrate having at least two module attachment regions spaced apart from each other; at least two sub-modules respectively attached to the at least two module attachment regions and spaced apart from each other on the main film substrate, wherein each of the at least two sub-modules comprise a sub-film substrate and a semiconductor chip mounted on the sub-film substrate; and at least two connection conductive layers provided between the main film substrate and the sub-film substrate, which is included in each of the at least two sub-modules, and electrically connecting the main film substrate to the at least two sub-modules.