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    HYBRID ELEMENT AND METHOD OF FABRICATING THE SAME
    12.
    发明申请
    HYBRID ELEMENT AND METHOD OF FABRICATING THE SAME 有权

    公开(公告)号：US20220262784A1

    公开(公告)日：2022-08-18

    申请号：US17667241

    申请日：2022-02-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Dongho KIM ,  Hyunjoon KIM ,  Joonyong PARK ,  Seogwoo HONG

    IPC: H01L25/00 ,  H01L27/15 ,  H01L25/16

    Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.

    MICRO LIGHT EMITTING DEVICE ARRAY AND METHOD OF MANUFACTURING THE SAME
    13.
    发明申请
    MICRO LIGHT EMITTING DEVICE ARRAY AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220122953A1

    公开(公告)日：2022-04-21

    申请号：US17315596

    申请日：2021-05-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Hyunjoon KIM ,  Joonyong PARK ,  Seogwoo HONG

    IPC: H01L25/13 ,  H01L23/00

    Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

    SEMICONDUCTOR APPARATUS
    16.
    发明申请
    SEMICONDUCTOR APPARATUS 有权

    公开(公告)号：US20250157879A1

    公开(公告)日：2025-05-15

    申请号：US18746857

    申请日：2024-06-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongkyun KIM ,  Sungchan KANG ,  Daehyuk SON ,  Hotaik LEE ,  Seogwoo HONG

    IPC: H01L23/427

    Abstract: A semiconductor apparatus includes a semiconductor chip including a semiconductor integrated circuit, a cooling channel at least partially in the semiconductor chip and including a fine pattern on at least a portion of a wall surface of the cooling channel, the fine pattern configured to generate a capillary pressure that induces a flow of a liquid coolant, and a temperature controller configured to control a supply temperature of the liquid coolant supplied to the cooling channel.

    DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
    17.
    发明申请
    DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20250133890A1

    公开(公告)日：2025-04-24

    申请号：US19005626

    申请日：2024-12-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Joonyong PARK ,  Dongho KIM ,  Hyunjoon KIM ,  Seogwoo HONG ,  Kyungwook HWANG ,  Junsik HWANG

    IPC: H10H29/14 ,  B82Y20/00 ,  H10H20/01 ,  H10H20/851 ,  H10H20/855

    Abstract: A display apparatus includes a driving substrate including a plurality of grooves, micro light-emitting devices provided in the plurality of grooves and configured to emit light of a first color, and a color conversion layer provided on the micro light-emitting devices and configured to convert the light of the first color into light of at least one second color, wherein the color conversion layer includes light blocking patterns spaced apart from the micro light-emitting devices and spaced apart from each other on a same plane, a nano-porous layer provided between adjacent ones of the light blocking patterns, spaced apart from the micro light-emitting devices, and including a plurality of nano-pores, and quantum dots impregnated in the nano-porous layer and configured to convert the light of the first color into the light of the at least one second color.

    METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODES
    18.
    发明公开
    METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODES 审中-公开

    公开(公告)号：US20230231072A1

    公开(公告)日：2023-07-20

    申请号：US18180602

    申请日：2023-03-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seogwoo HONG ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

    IPC: H01L33/00 ,  H01L25/075

    CPC classification number: H01L33/005 ,  H01L25/0753

    Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

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