公开(公告)号：US20150024551A1

公开(公告)日：2015-01-22

申请号：US14283238

申请日：2014-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoshiaki YUKIMORI ,  Shinji UEYAMA ,  Masato KAJINAMI

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L24/93 ,  H01L21/561 ,  H01L21/78 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/83091 ,  H01L2224/83121 ,  H01L2224/83203

Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.

Abstract translation: 一种制造半导体器件的方法包括：提供包括内部布线的第一基板，所述第一基板包括具有第一芯片安装区域的芯片安装区域阵列; 将第一衬底放置在第一载体线上; 提供第一半导体芯片; 将第一半导体芯片放置在第一可移动托盘上; 将第一基板的第一芯片安装区域与第一半导体芯片垂直对准，并且将第一半导体芯片初始接合到第一基板的第一芯片安装区域; 以及在所述第一基板的初始接合的第一半导体芯片和第一安装区域上进行后续的接合，从而在所述第一安装区域将所述第一半导体芯片与所述第一基板更牢固地接合。 在执行第一衬底上的至少一个其它半导体芯片的后续接合之后发生初始接合。