公开(公告)号：US10453788B2

公开(公告)日：2019-10-22

申请号：US15988893

申请日：2018-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong II Lee ,  Jeong Ho Lee ,  Jin Su Kim ,  Bong Ju Cho

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  H01L23/495 ,  H01L23/31

Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers disposed on the insulating layers, and connection via layers penetrating through the insulating layers and electrically connecting the wiring layers to each other, and having a recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and an active surface of the semiconductor chip and including one or more redistribution layers electrically connecting the wiring layers and the connection pads to each other, in which the recess portion includes walls having different inclined angles.

公开(公告)号：US10985127B2

公开(公告)日：2021-04-20

申请号：US16698516

申请日：2019-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong Ho Lee ,  Bong Ju Cho ,  Young Gwan Ko ,  Jin Su Kim ,  Shang Hoon Seo ,  Jeong Il Lee

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31 ,  H01L21/683

Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface, and disposed in the recess portion so that the inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers of the frame and the connection pads of the semiconductor chip to each other, wherein the stopper layer includes an insulating material.

公开(公告)号：US10903548B2

公开(公告)日：2021-01-26

申请号：US16410853

申请日：2019-05-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Koon Lee ,  Jin Su Kim

IPC: H01Q1/22 ,  H01Q1/48 ,  H01L23/31 ,  H01L23/538 ,  H01L23/367 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q9/16

Abstract: An antenna module includes an antenna substrate having a first surface and a second surface disposed to oppose each other, and including a substrate wiring layer having a first antenna pattern positioned in a first region, a second antenna pattern disposed in a second region adjacent to one side, and first and second feed patterns connected to the first and second antenna patterns, respectively; and a semiconductor package including a connection structure disposed on the second surface except for an area overlapping with the second region of the antenna substrate and redistribution layers electrically connected to the substrate wiring layer, and at least one semiconductor chip having connection pads connected to the redistribution layers. A region overlapping with the second feed pattern in each of the plurality of redistribution layers is provided as an opened region.

公开(公告)号：US10896884B2

公开(公告)日：2021-01-19

申请号：US16281819

申请日：2019-02-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Koon Lee ,  Jin Su Kim

IPC: H01L23/66 ,  H01L23/552 ,  H01L23/538 ,  H01L23/495 ,  H01Q1/22

Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip having an active surface on which a connection pad is disposed; a first encapsulant encapsulating at least a portion of the semiconductor chip; a second encapsulant disposed on at least a portion of the external side surface of the frame, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip. The frame includes an insulating layer, a wiring layer disposed on upper and lower surfaces of the insulating layer, a first metal layer on the external side wall of the insulating layer, a second metal layer on the internal side wall of the first through hole, and a via penetrating the upper and lower surfaces of the insulating layer.

公开(公告)号：US10763217B2

公开(公告)日：2020-09-01

申请号：US16282638

申请日：2019-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Koon Lee ,  Jin Su Kim

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L23/522

Abstract: A semiconductor package and an antenna module including the same includes a frame having first and second through-holes, a semiconductor chip disposed in the first through-hole of the frame and having an active surface on which a connection pad is disposed and an inactive surface disposed on an opposite side of the active surface, a wiring chip disposed in the second through-hole of the frame and including a body portion and a plurality of through vias penetrating the body portion, an encapsulant encapsulating at least portions of the semiconductor chip and the wiring chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and the through via of the wiring chip.

公开(公告)号：US10403579B2

公开(公告)日：2019-09-03

申请号：US15802131

申请日：2017-11-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han Ul Lee ,  Jin Su Kim ,  Young Gwan Ko

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device includes a semiconductor chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the semiconductor chip, a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads, a passivation layer disposed on the connection member, and an under bump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad embedded in the passivation layer and having a recess portion, and a UBM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.