公开(公告)号：US11158579B2

公开(公告)日：2021-10-26

申请号：US16561276

申请日：2019-09-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han Ul Lee ,  Young Gwan Ko

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes a frame having a cavity and having a wiring structure connecting first and second surfaces opposing each other; a connection structure disposed on the first surface of the frame and including a first redistribution layer connected to the wiring structure; a semiconductor chip disposed in the cavity and having a connection pad connected to the first redistribution layer; an encapsulant encapsulating the semiconductor chip; and a second redistribution layer having a redistribution pattern and a connection via connecting the wiring structure and the redistribution pattern. The connection via includes a first via connected to the wiring structure and a second via disposed on the first via and connected to the redistribution pattern, a lower surface of the second via has an area larger than an area of an upper surface of the first via.

公开(公告)号：US10403579B2

公开(公告)日：2019-09-03

申请号：US15802131

申请日：2017-11-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han Ul Lee ,  Jin Su Kim ,  Young Gwan Ko

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device includes a semiconductor chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the semiconductor chip, a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads, a passivation layer disposed on the connection member, and an under bump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad embedded in the passivation layer and having a recess portion, and a UBM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.