公开(公告)号：US11462410B2

公开(公告)日：2022-10-04

申请号：US16845959

申请日：2020-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nohsung Kwak ,  Euijin Seo ,  Jonghwi Seo ,  Jaehee Lee ,  Ilyoung Han ,  Guesuk Lee

IPC: H01L21/20 ,  H01L21/268 ,  B23K26/066 ,  B23K26/352

Abstract: A semiconductor manufacturing apparatus is provided including a beam shaper arranged on a light path of a laser beam and including a plurality of mask modules. The plurality of mask modules defines a light blocking region and a light transmitting region. At least one mask module of the plurality of mask modules includes a blocking plate configured to block a portion of the laser beam, and a driver is configured to move the blocking plate.

公开(公告)号：US20240266317A1

公开(公告)日：2024-08-08

申请号：US18638947

申请日：2024-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyeong Kim ,  Ilyoung Han ,  Hoechul Kim

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L24/16 ,  H01L24/80 ,  H01L2224/08145 ,  H01L2224/80091 ,  H01L2224/80095 ,  H01L2224/8012 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908

Abstract: A substrate bonding method and apparatus are described. The substrate bonding apparatus is used to bond a first substrate to a second substrate. The bonding apparatus includes a first bonding chuck configured to hold the first substrate on a first surface of the first bonding chuck; a second bonding chuck configured to hold the second substrate on a second surface of the second bonding chuck, the second surface facing the first surface of the first bonding chuck; a seal arranged between the first bonding chuck and the second bonding chuck and adjacent to at least one edge of the first substrate and at least one edge of the second substrate; and a process gas supply device configured to supply a process gas to a bonding space surrounded by the seal.

公开(公告)号：US11984345B2

公开(公告)日：2024-05-14

申请号：US18135017

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilyoung Han ,  Hunyong Park ,  Sohee Han ,  Nohsung Kwak

IPC: H01L21/687

CPC classification number: H01L21/68742 ,  H01L21/68785

Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.

公开(公告)号：US20210082704A1

公开(公告)日：2021-03-18

申请号：US16845959

申请日：2020-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nohsung Kwak ,  Euijin Seo ,  Jonghwi Seo ,  Jaehee Lee ,  Ilyoung Han ,  Guesuk Lee

IPC: H01L21/268 ,  B23K26/352 ,  B23K26/066

Abstract: A semiconductor manufacturing apparatus is provided including a beam shaper arranged on a light path of a laser beam and including a plurality of mask modules. The plurality of mask modules defines a light blocking region and a light transmitting region. At least one mask module of the plurality of mask modules includes a blocking plate configured to block a portion of the laser beam, and a driver is configured to move the blocking plate.

公开(公告)号：US09553069B2

公开(公告)日：2017-01-24

申请号：US14852825

申请日：2015-09-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Kyoungran Kim ,  Donggil Shim ,  Geunsik Oh ,  Youngjoo Lee ,  Junho Lee ,  Sukwon Lee

IPC: B23K37/04 ,  H01L23/00 ,  B23K3/08

CPC classification number: H01L24/75 ,  B23K3/087 ,  B23K37/04 ,  H01L2224/75252 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/7598

Abstract: A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.

Abstract translation: 基板制造装置的接合装置包括上层，与上层相对的下层，其构造为专用于支撑半导体芯片堆叠的被处理基板（设置），以及用于升高下层相对的升降机构 以提供将基板和芯片彼此挤压的压力。