公开(公告)号：US11651990B2

公开(公告)日：2023-05-16

申请号：US16712413

申请日：2019-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilyoung Han ,  Hunyong Park ,  Sohee Han ,  Nohsung Kwak

IPC: H01L21/687

CPC classification number: H01L21/68742 ,  H01L21/68785

Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.

公开(公告)号：US11984345B2

公开(公告)日：2024-05-14

申请号：US18135017

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilyoung Han ,  Hunyong Park ,  Sohee Han ,  Nohsung Kwak

IPC: H01L21/687

CPC classification number: H01L21/68742 ,  H01L21/68785

Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.