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公开(公告)号:US11063174B2
公开(公告)日:2021-07-13
申请号:US16653449
申请日:2019-10-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung Kwag , Masaru Wada , Jamyeong Koo , Eunhye Kim , Sangmoo Park , Seona Yang , Minsub Oh , Yoonsuk Lee , Youngkyong Jo
Abstract: A light emitting diode (LED) includes: a device substrate; a first semiconductor layer above the device substrate, and doped with an n-type dopant; a second semiconductor layer above the first semiconductor layer, and doped with a p-type dopant; an active layer between the first semiconductor layer and the second semiconductor layer and configured to provide light; a transparent electrode layer adjacent to an upper part of the second semiconductor layer; and a first electrode pad and a second electrode pad between the device substrate and the first semiconductor layer, the first electrode pad electronically connected with the first semiconductor layer and the second electrode pad electrically connected with the second semiconductor layer, wherein light provided by the active layer is irradiated to an outside in a direction from the active layer to the second semiconductor layer.
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公开(公告)号:US11916047B2
公开(公告)日:2024-02-27
申请号:US17574104
申请日:2022-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung Kwag , Eunhye Kim , Sangmoo Park , Minsub Oh , Yoonsuk Lee
CPC classification number: H01L25/0753 , H01L24/06 , H01L25/167 , H01L33/48 , H01L33/62 , H01L33/06 , H01L33/32 , H01L33/38
Abstract: A display apparatus includes a substrate in which a plurality of pads are disposed, a plurality of micro LEDs, wherein each micro LED from among the plurality of micro LEDs is electrically connected to a respective group of pads from among the plurality of pads and mounted on the substrate, and a plurality of protrusion members, wherein each protrusion member from among the plurality of protrusion members protrudes from the substrate and is formed adjacent to a respective pad from among the plurality of pads.
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13.
公开(公告)号:US20230419022A1
公开(公告)日:2023-12-28
申请号:US18244095
申请日:2023-09-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kangmin LEE , Eunhye Kim , Miseon Hwang
IPC: G06F40/174 , G06F3/04817 , G06V20/62 , G06F3/0484
CPC classification number: G06F40/174 , G06F3/04817 , G06V20/62 , G06F3/0484 , G06V2201/02
Abstract: An electronic device includes: a communication module; a display; a memory, at least one processor operatively connected to the communication module, the display, and the memory; and wherein the memory stores instructions configured to, when executed, cause the at least one processor to: display an application screen of an application on the display, identify a data input field on the application screen, identify a data type corresponding to the data input field, display at least one external electronic device capable of providing data corresponding to the identified data type, receive the data corresponding to the identified data type from the at least one external electronic device, and enter the received data into the data input field.
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14.
公开(公告)号:US11849613B2
公开(公告)日:2023-12-19
申请号:US17523281
申请日:2021-11-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunhye Kim , Doyoung Kwag , Sangmoo Park , Minsub Oh , Yoonsuk Lee
IPC: H10K59/131 , H10K59/121
CPC classification number: H10K59/131 , H10K59/1213
Abstract: A display module includes a substrate; light emitting diodes, first connection pads, second connection pads, and side wirings. The light emitting diodes are arranged on one surface of the substrate. The first connection pads are formed on the one surface of the substrate. The second connection pads are formed on an opposite surface of the one surface. The side wirings are formed on each of a first edge of the substrate and a second edge of the substrate that is adjacent to the first edge. The side wirings electrically couple the first connection pads on the one surface of the substrate with respective ones of the second connection pads on the opposite surface.
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公开(公告)号:US11791322B2
公开(公告)日:2023-10-17
申请号:US17677182
申请日:2022-02-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung Kwag , Byungchul Kim , Eunhye Kim , Sangmoo Park , Minsub Oh , Dongyeob Lee , Yoonsuk Lee
CPC classification number: H01L25/13 , H01L33/005
Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.
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公开(公告)号:US20220173270A1
公开(公告)日:2022-06-02
申请号:US17674520
申请日:2022-02-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonsuk LEE , Sangmoo Park , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Minsub Oh , Dongyeob Lee
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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公开(公告)号:US20200161159A1
公开(公告)日:2020-05-21
申请号:US16682111
申请日:2019-11-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangmoo PARK , Doyoung Kwag , Eunhye Kim , Minsub Oh , Yoonsuk Lee
IPC: H01L21/683 , H01L21/67 , H01L33/62
Abstract: A micro LED transfer device is provided. The micro LED transfer device includes a transfer part configured to arrange a first substrate wherein a plurality of LEDs are disposed on a lower surface relative to an upper surface of a second substrate; a memory storing characteristic information of each of the plurality of LEDs; a laser light source configured to irradiate laser light; a mask comprising a plurality of shutters configured to selectively open and close a plurality of openings of the mask, the mask being interposed between the first substrate and the laser light source; and a processor configured to identify an LED from among the plurality of LEDs to be arranged on the second substrate based on the stored characteristic information, and control the mask such that a shutter from among the plurality of shutters that corresponds to the LED is opened.
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18.
公开(公告)号:US20200083283A1
公开(公告)日:2020-03-12
申请号:US16561161
申请日:2019-09-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoonsuk Lee , Doyoung Kwag , Eunhye Kim , Sangmoo Park , Minsub Oh
Abstract: A display module includes a substrate, a plurality of LEDs that are disposed on the substrate and irradiate light, and a light blocking layer that covers the plurality of LEDs, and fills intervals among the plurality of LEDs, each interval of the intervals being a distance between two adjacent LEDs of the plurality of LEDs, and wherein the light blocking layer includes a plurality of openings formed such that a top surface of each of the plurality of LEDs is exposed
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公开(公告)号:US20230387095A1
公开(公告)日:2023-11-30
申请号:US18208034
申请日:2023-06-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaeseok Kim , Eunhye Kim , Sangmoo Park , Yoonsuk Lee , Seungryong Han
CPC classification number: H01L25/167 , H01L24/29 , H01L24/32 , H01L2224/2919 , H01L2224/29144 , H01L2224/29155 , H01L2224/29164 , H01L2224/29021 , H01L2224/29028 , H01L2224/32147 , H01L2924/12041
Abstract: In some embodiments, a display module for implementing an image using an inorganic light emitting device includes a substrate, a thin film transistor (TFT) layer provided on the substrate, a plurality of connection pads provided on the TFT layer, an anisotropic conductive layer provided on the TFT layer, an inorganic light emitting element bonded to the anisotropic conductive layer, and a conductive ball control layer provided in a surrounding area of the plurality of connection pads. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive balls distributed inside the adhesive layer. The inorganic light emitting element includes a plurality of electrodes corresponding to the plurality of connection pads. The conductive ball control layer is configured to restrict the plurality of conductive balls from moving in a direction perpendicular to a bonding direction while the inorganic light emitting element is being bonded to the anisotropic conductive layer.
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公开(公告)号:US11289622B2
公开(公告)日:2022-03-29
申请号:US16832884
申请日:2020-03-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonsuk Lee , Sangmoo Park , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Minsub Oh , Dongyeob Lee
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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