公开(公告)号：US20190311994A1

公开(公告)日：2019-10-10

申请号：US16181397

申请日：2018-11-06

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Suk Youn HONG ,  Jang Hyun KIM ,  Hye Kyung KIM ,  Seung Hyun HONG ,  Jong In RYU

IPC: H01L23/552 ,  H05K1/02 ,  H05K1/14 ,  H01L21/56 ,  H01L21/48 ,  H05K3/36 ,  H05K3/28

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

公开(公告)号：US20190304926A1

公开(公告)日：2019-10-03

申请号：US16181404

申请日：2018-11-06

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong In RYU ,  Suk Youn HONG ,  Gi Su CHI ,  Seung Hyun HONG ,  Ki Chan KIM

IPC: H01L23/552 ,  H01L23/538 ,  H01L23/31 ,  H01L23/66 ,  H01L25/00 ,  H01L21/56 ,  H01L25/16

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

公开(公告)号：US20170301632A1

公开(公告)日：2017-10-19

申请号：US15637220

申请日：2017-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae YOO ,  Kyu Hwan OH ,  Jong In RYU ,  Jae Hyun LIM

IPC: H01L23/552 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/48 ,  H01L23/31 ,  H01L21/78

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: The method of manufacturing a package comprising: preparing a strip substrate having a plurality of separate package regions which are partitioned by a dicing region and via pads which are connected to one ends of plated tails which are divided to be disconnected in the dicing region; mounting at least one electronic component on at least one surface of each package region of the substrate; forming a connection pattern having conductivity in disconnected portions of the plated tails to form electrical connections therebetween; forming a molded part on the surface of the substrate to enclose the electronic component; forming at least one via penetrating through the molded part by applying current through the plated tails; and dicing the substrate in the dicing region to divide the substrate into separate packages, each having the connection pattern exposed to the exterior of the substrate.

公开(公告)号：US20150223361A1

公开(公告)日：2015-08-06

申请号：US14260007

申请日：2014-04-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun LIM ,  Jong In RYU ,  Sun Ho KIM ,  Eun Jung JO ,  Kyu Hwan OH ,  Do Jae YOO

IPC: H05K7/02 ,  H05K13/04 ,  H05K3/34

CPC classification number: H05K3/3478 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/111 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/09409 ,  H05K2201/09436 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10787 ,  H05K2203/0228 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Abstract translation: 提供一种能够通过将电子部件安装在基板的两个表面上而提高集成度的电子部件模块及其制造方法。 根据本公开的示例性实施例的电子部件模块包括：基板; 安装在所述基板的两个表面上的多个电子部件; 连接导体各自具有使用导电粘合剂结合到基板的一个表面的一端; 以及模制部分，其具有嵌入其中并且形成在基板的一个表面上的连接导体，其中连接导体可以具有防止导电粘合剂扩散的至少一个阻挡构件。