公开(公告)号：US20140302624A1

公开(公告)日：2014-10-09

申请号：US14012916

申请日：2013-08-28

Applicant: Samsung Display Co., ltd.

Inventor： Sun-Ho Kim ,  Myung-Soo Huh ,  Jeong-Ho Yi ,  Cheol-Rae Jo ,  Hyun-Woo Joo ,  Yong-Suk Lee

IPC: H01L21/56 ,  H01L51/00

CPC classification number: H01L21/56 ,  C23C14/24 ,  C23C14/564 ,  C23C16/4412 ,  H01L51/0008

Abstract: A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.

Abstract translation: 一种沉积装置，被配置为在基板上进行沉积处理，所述沉积装置包括：具有在表面中具有排气开口的室，所述室中的沉积源构造成朝向所述基板排出一个或多个沉积材料;对应于 形成有排气口的室的内表面，与冷却板接触的冰箱以及连接到排气口的泵。

公开(公告)号：US20140291626A1

公开(公告)日：2014-10-02

申请号：US13965182

申请日：2013-08-12

Applicant: Samsung Display Co., LTD

Inventor： Myung-Soo Huh ,  Sun-Ho Kim ,  Hyun-Woo Joo ,  Jae-Hyun Kim

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00

CPC classification number: H01L51/5253 ,  H01L27/3244 ,  H01L51/001 ,  H01L51/5012 ,  H01L51/56 ,  H01L2251/558

Abstract: A deposition apparatus is configured to form a deposition layer on a substrate. The deposition apparatus includes a deposition source configured to face a first side of the substrate and to spray one or more depositing materials toward the substrate, a cooling stage configured to support a second side of the substrate that is opposite from the first side of the substrate, and a hardening unit configured to harden the one or more depositing materials sprayed from the deposition source and that have reached the substrate. A method of forming a thin film deposition layer on a substrate by using a deposition apparatus is also provided. The method includes spraying one or more depositing materials toward the substrate by using a deposition source of the deposition apparatus while the substrate is on a cooling stage of the deposition apparatus.

Abstract translation: 沉积装置被配置为在基底上形成沉积层。 沉积设备包括沉积源，其构造成面向基板的第一侧并且向基板喷射一个或多个沉积材料;冷却台，被配置为支撑基板的与基板的第一侧相对的第二面 以及硬化单元，其被配置为硬化从沉积源喷射并且已经到达基板的一个或多个沉积材料。 还提供了通过使用沉积设备在基板上形成薄膜沉积层的方法。 该方法包括通过使用沉积设备的沉积源将一种或多种沉积材料喷射到衬底，同时衬底位于沉积设备的冷却台上。