Abstract:
A manufacturing method of a backlight unit includes providing a solder paste on a printed circuit board and forming a solder part in a first area of the printed circuit board, aligning a bank mask on the printed circuit board to align a first opening defined through the bank mask with a second area of the printed circuit board not overlapped with the first area, providing a bank material in the first opening and forming a bank on the printed circuit board in an area corresponding to the second area, separating the bank mask from the printed circuit board including the bank thereon, and connecting the solder part of the printed circuit board and a light emitting unit to each other.
Abstract:
A display apparatus includes a display panel including a plurality of subpixels, where each subpixel includes one of a first color filter having a first primary color, a second color filter having a second primary color and a third color filter having a third primary color, and a light source part which provides light to the display panel, where the light source part includes a first light source which generates a first light having the first primary color and a second light source which generates a second light having a mixed color of the second primary color and the third primary color, where the first light source and the second light source are alternately in a turned-on state.
Abstract:
A light-emitting device module includes a substrate and a light-emitting device disposed on the substrate. The light-emitting device may have a first pad and a second pad disposed thereon. A coating layer may cover the light-emitting device. The coating layer has a first via hole and a second via hole configured to respectively expose the first pad and the second pad therethrough. Wirings configured to be electrically connected to the first pad and the second pad through the first via hole and the second via hole are disposed on the coating layer.
Abstract:
A light emitting diode (LED), includes: a substrate; a first electrode connection line disposed on the substrate; a second electrode connection line disposed on the substrate; a first contact metal layer disposed on the first electrode connection line; a second contact metal layer disposed on the second electrode connection line; a light emitting unit disposed on the first contact metal layer and the second contact metal layer; a partition disposed on the substrate and about the light emitting unit; and an encapsulation layer covering the light emitting unit. The encapsulation layer includes a light conversion material.