公开(公告)号：US20230042192A1

公开(公告)日：2023-02-09

申请号：US17948564

申请日：2022-09-20

Applicant: Samsung Display Co., Ltd.

Inventor： HEE-KWON LEE

IPC: H05K1/02 ,  H05K1/18

Abstract: A display device including: a display module including a display panel for displaying an image and a circuit board connected to the display panel; a support plate disposed on a surface of the display module; and a conductive adhesive film disposed between the circuit board and the support plate, the conductive adhesive film including: a double-sided adhesive film fixed to a surface of the support plate and a surface of the circuit board; and a single-sided adhesive film fixed to one of the surface of the support plate and the surface of the circuit board.

公开(公告)号：US20210335170A1

公开(公告)日：2021-10-28

申请号：US17367574

申请日：2021-07-05

Applicant: Samsung Display Co., Ltd.

Inventor： HEE-KWON LEE ,  SEUNGKYUN HONG

IPC: G09G3/00 ,  H05K1/02 ,  G09G3/20 ,  G02F1/1345 ,  H01L23/31 ,  H01L23/482 ,  H01L23/498

Abstract: A chip-on-film package includes a base substrate on which a first pad region, a second pad region, and a third region located between the first pad region and the second pad region are defined, a dummy pad disposed on the first pad region, input pads disposed on the first pad region, output pads disposed on the second region, a first detection line disposed on the base substrate, and a second detection line disposed on the base substrate. The first detection line is connected to a first input pad and a second input pad via the second pad region to form a first loop between the first input pad and the second input pad, and the second detection line is connected to the dummy pad and the first detection line via the third region to form a second loop between the dummy pad and the first input pad.