公开(公告)号：US12033924B2

公开(公告)日：2024-07-09

申请号：US17542828

申请日：2021-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeonghyun Lee ,  Hwanpil Park ,  Jongbo Shim

IPC: H01L23/64 ,  H01L23/31 ,  H01L23/498 ,  H01L25/18

CPC classification number: H01L23/49811 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/642 ,  H01L25/18

Abstract: A semiconductor package includes a package substrate, an interposer, a semiconductor chip between the package substrate and the interposer, a plurality of conductive connectors between the package substrate and the interposer, and a capacitor stack structure between the package substrate and the interposer, he capacitor stack structure including a first capacitor connected to the package substrate, and a second capacitor connected to the interposer.

公开(公告)号：US11898787B2

公开(公告)日：2024-02-13

申请号：US17225576

申请日：2021-04-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taecheol Park ,  Byoungmok Kim ,  Jonghyun Son ,  Jeonghyun Lee ,  Seokjun Son

IPC: F25D23/02 ,  G01S7/48 ,  H05B47/115

CPC classification number: F25D23/028 ,  G01S7/4808 ,  H05B47/115 ,  F25D2700/04

Abstract: A refrigerator is provided. The refrigerator includes a main body including a first door, a door opening device configured to open the first door, a first proximity sensor disposed adjacent to the first door, a first infrared sensor disposed on the first door, and at least one processor, wherein the at least one processor is configured to, based on detection data obtained by the first proximity sensor, control the door opening device to open the first door based on an external object approaching within a threshold distance from the refrigerator, and based on the external object being identified based on detection data obtained by the first infrared sensor while the first door is open, control the door opening device to stop opening of the first door.

公开(公告)号：US11804477B2

公开(公告)日：2023-10-31

申请号：US17371834

申请日：2021-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeonghyun Lee ,  Jihwang Kim ,  Jongbo Shim

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L25/105 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16155 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/182 ,  H01L2924/186

Abstract: A semiconductor device having a package on package (PoP) structure, in which a fine pitch between package substrates is implemented, a total height of a package is reduced, and reliability is enhanced. The semiconductor package includes a first package substrate including a first body layer and a first passivation layer, a first semiconductor chip on the first package substrate, a second package substrate on the first package substrate, the second package substrate including a second body layer and a second passivation layer, a first connection member on the first package substrate outside the first semiconductor chip, and a gap filler filled between the first package substrate and the second package substrate, wherein the first package substrate includes a first trench, the second package substrate includes a second trench, and the first semiconductor chip is disposed between the first trench and the second trench.

公开(公告)号：US11768027B2

公开(公告)日：2023-09-26

申请号：US17099627

申请日：2020-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chomin Lee ,  Byoungmok Kim ,  Oungu Lee ,  Jeonghyun Lee ,  Dongyeong Kim ,  Minseok Choi ,  Yang-yeol Gu ,  Ae-ryun Kim ,  Yountae Shin ,  Donghyun Lee ,  Seonju Lee ,  Jaemin Lee

IPC: F25D23/02

CPC classification number: F25D23/02 ,  F25D2323/021

Abstract: A refrigerator including: a main body forming a storage compartment and a door provided to open and close the storage compartment, wherein the door includes a door frame, a cover arranged in front of the door frame and including a cover fixer, and a door panel arranged in front of the cover, the door panel including a first fixer and a second fixer on a rear surface of the door panel. When the door panel is coupled to a front side of the cover, the first fixer is coupled to the door frame and the second fixer is coupled to the cover.

公开(公告)号：US11578519B2

公开(公告)日：2023-02-14

申请号：US17161208

申请日：2021-01-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taecheol Park ,  Byoungmok Kim ,  Jeonghyun Lee ,  Seokjun Son

IPC: E05D7/00 ,  E05D3/02 ,  F25D23/02

Abstract: Disclosed is a refrigerator with a storage space. The refrigerator includes a main body including a storage space, a door configured to open and close the storage space, and a hinge provided under the door and configured to rotatably couple the door to the main body. The hinge includes a linear member accommodator configured to accommodate therein a linear member drawn out from the door, and a cut-out portion hollowed and configured to extend along a hinge axial direction to allow the linear member accommodator to communicate with an outside at one side.

公开(公告)号：US20220181309A1

公开(公告)日：2022-06-09

申请号：US17371834

申请日：2021-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeonghyun Lee ,  Jihwang Kim ,  Jongbo Shim

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor device having a package on package (PoP) structure, in which a fine pitch between package substrates is implemented, a total height of a package is reduced, and reliability is enhanced. The semiconductor package includes a first package substrate including a first body layer and a first passivation layer, a first semiconductor chip on the first package substrate, a second package substrate on the first package substrate, the second package substrate including a second body layer and a second passivation layer, a first connection member on the first package substrate outside the first semiconductor chip, and a gap filler filled between the first package substrate and the second package substrate, wherein the first package substrate includes a first trench, the second package substrate includes a second trench, and the first semiconductor chip is disposed between the first trench and the second trench.

公开(公告)号：US11287174B2

公开(公告)日：2022-03-29

申请号：US17099661

申请日：2020-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chomin Lee ,  Byoungmok Kim ,  Oungu Lee ,  Jeonghyun Lee ,  Dongyeong Kim ,  Minseok Choi ,  Yang-yeol Gu ,  Ae-ryun Kim ,  Yountae Shin ,  Donghyun Lee ,  Seonju Lee ,  Jaemin Lee

IPC: F25D23/02

Abstract: A refrigerator including: a main body forming a storage compartment and a door provided to open and close the storage compartment, wherein the door includes a door frame, a cover arranged in front of the door frame and including a cover fixer, and a door panel arranged in front of the cover, the door panel including a first fixer and a second fixer on a rear surface of the door panel. When the door panel is coupled to a front side of the cover, the first fixer is coupled to the door frame and the second fixer is coupled to the cover.

公开(公告)号：USD826295S1

公开(公告)日：2018-08-21

申请号：US29607504

申请日：2017-06-14

Applicant: Samsung Electronics Co., Ltd.

Designer： Jeonghyun Lee

公开(公告)号：USD792914S1

公开(公告)日：2017-07-25

申请号：US29568384

申请日：2016-06-17

Applicant: Samsung Electronics Co., Ltd.

Designer： Jeonghyun Lee ,  Yongbum Seo ,  Wooyeol Yoo