公开(公告)号：US20220217843A1

公开(公告)日：2022-07-07

申请号：US17230437

申请日：2021-04-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Uk Lee ,  Sangik Cho ,  Eun Sun Kim ,  Young Hun You ,  Jong Eun Park

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/20

Abstract: A printed circuit board includes an insulating layer, a circuit pattern embedded in the insulating layer and including a first metal layer, a second metal layer and a third metal layer disposed between the first metal layer and the second metal layer, and a connection conductor disposed on one surface of the insulating layer and connected to the circuit pattern, wherein the first metal layer is exposed through the one surface of the insulating layer.