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    WIRE-BASED INDUCTORS
    12.
    发明申请
    WIRE-BASED INDUCTORS 审中-公开

    公开(公告)号：US20200258674A1

    公开(公告)日：2020-08-13

    申请号：US16273225

    申请日：2019-02-12

    Applicant: Raytheon Company

    Inventor： Jonathan Frasch ,  Gary A. Frazier ,  Kyle L. Grosse

    IPC: H01F27/28 ,  H01F27/24 ,  H01F1/42 ,  H01F41/069 ,  H01F27/34 ,  D02G3/36 ,  D02G3/02 ,  D02G3/44

    Abstract: A continuous wire that includes a wound inductance from a first yarn material formed of filaments or nanotubes, the first yarn being doped with or including a first material that causes it to be electrically conductive and a second yarn formed of material filaments or nanotubes that is electrically insulating and may include magnetic particles wound with the first yarn in bifilar fashion or both yarns wrapped in a bifilar fashion around an insulating core yarn which may include magnetic particles to increase the inductance of the wire. The doping and electrical conductance of the yarns can be varied along the length of the wire to integrate sections of lumped electrical conductance and inductance.

    APERTURES WITH DYNAMICALLY VARIABLE ELECTROMAGNETIC PROPERTIES
    15.
    发明申请
    APERTURES WITH DYNAMICALLY VARIABLE ELECTROMAGNETIC PROPERTIES 有权

    公开(公告)号：US20210044364A1

    公开(公告)日：2021-02-11

    申请号：US16537212

    申请日：2019-08-09

    Applicant: RAYTHEON COMPANY

    Inventor： Kyle L. Grosse ,  Gary A. Frazier ,  Catherine Trent ,  Ralph Korenstein

    IPC: H04B15/02 ,  H03H7/01 ,  H03H9/24

    Abstract: A dynamic aperture is disclosed. A dynamic aperture includes a base layer, a conductive structure disposed on the base layer, and a layer of a material having a dynamically controllable electrical conductivity that is disposed over the base layer and the conductive structure. A transmission profile of the dynamic aperture is determined by a combination of the conductive structure and the layer of the material. The transmission profile is dynamically alterable by controlling the electrical conductivity of the layer of the material.

    Patterned Conductive Microstructures within a Heat Shrinkable Substrate
    16.
    发明申请
    Patterned Conductive Microstructures within a Heat Shrinkable Substrate 有权

    公开(公告)号：US20210014959A1

    公开(公告)日：2021-01-14

    申请号：US16934951

    申请日：2020-07-21

    Applicant: Raytheon Company

    Inventor： Kyle L. Grosse ,  Catherine Trent

    IPC: H05K1/02 ,  G03F7/00 ,  H05K3/22

    Abstract: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

    Method of making patterned conductive microstructures within a heat shrinkable substrate
    17.
    发明授权
    Method of making patterned conductive microstructures within a heat shrinkable substrate 有权

    公开(公告)号：US10721815B2

    公开(公告)日：2020-07-21

    申请号：US16029507

    申请日：2018-07-06

    Applicant: Raytheon Company

    Inventor： Kyle L. Grosse ,  Catherine Trent

    IPC: H05K1/02 ,  G03F7/00 ,  H05K3/22

    Abstract: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

    Tailored Conductive Interconnect Structures Having Microstructures Supported By A Shrinkable Polymer
    18.
    发明申请
    Tailored Conductive Interconnect Structures Having Microstructures Supported By A Shrinkable Polymer 审中-公开

    公开(公告)号：US20200015349A1

    公开(公告)日：2020-01-09

    申请号：US16029507

    申请日：2018-07-06

    Applicant: Raytheon Company

    Inventor： Kyle L. Grosse ,  Catherine Trent

    IPC: H05K1/02 ,  H05K3/22 ,  G03F7/00

    Abstract: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

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