公开(公告)号：US08853834B2

公开(公告)日：2014-10-07

申请号：US13714023

申请日：2012-12-13

Applicant: Powertech Technology Inc.

Inventor： Wen-Jeng Fan ,  Che-Min Chu ,  Ming-Yen Wu

IPC: H01L23/552 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed is a leadframe-type semiconductor package having an EMI shielding layer connected to ground, comprising a leadframe, a chip, an encapsulant, and an EMI shielding layer. The encapsulant has two lead-extending sides and two leadless sides. The EMI shielding layer covers at least one surface of the encapsulant and the leadless sides. A metal tie bar coupling to the die attach pad of the leadframe has a cut end aligned with and exposed on one of the leadless sides. A ground lead also has a cut end aligned with and exposed on one of the leadless sides Since the EMI shielding layer covers and electrically connects the cut ends of the metal tie bar and the ground lead, the die pad with its metal tie bar of the leadframe is connected to the ground lead through external electrical connection outside the encapsulant to allow the die pad having ground potential.

Abstract translation: 公开了一种引线框式半导体封装，其具有连接到地的EMI屏蔽层，包括引线框架，芯片，密封剂和EMI屏蔽层。 密封剂具有两个引线延伸侧和两个无引线侧。 EMI屏蔽层覆盖密封剂和无引线侧的至少一个表面。 连接到引线框架的管芯附接焊盘的金属连接杆具有与无引线侧之一对准并暴露在其中一个无引线侧上的切割端。 接地引线还具有与无引线侧中的一个对准并露出的切割端。由于EMI屏蔽层覆盖并电连接金属连接杆和接地引线的切割端，芯片垫与其金属连接杆 引线框架通过密封剂外部的外部电连接连接到接地引线，以允许管芯焊盘具有接地电位。