公开(公告)号：US09837595B2

公开(公告)日：2017-12-05

申请号：US14717159

申请日：2015-05-20

Applicant: MediaTek Inc.

Inventor： Long-Kun Yu ,  Chin-Chiang Chang ,  Chia-Wei Chi ,  Chia-Feng Yeh ,  Tai-Yu Chen

IPC: H02J7/04 ,  H02J7/16 ,  H01L35/32 ,  H01L23/498 ,  H01L35/28 ,  H01L21/66 ,  H01L23/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/00 ,  H01L25/04 ,  H02J7/00 ,  H01L23/38

CPC classification number: H01L35/32 ,  H01L22/34 ,  H01L23/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/38 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/17 ,  H01L25/04 ,  H01L35/28 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17107 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/18161 ,  H02J7/0052 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.