公开(公告)号：US09611860B2

公开(公告)日：2017-04-04

申请号：US13998514

申请日：2013-11-07

Applicant: LG ELECTRONICS INC.

Inventor： Sangyuk Son ,  Junghoon Kim ,  Minu Son

IPC: F04D29/30 ,  F04D29/28

CPC classification number: F04D29/281 ,  F04D29/282 ,  F04D29/30

Abstract: A centrifugal fan and an air conditioner using the same are provided. A gurney flap having a rectangular plate or a S-shaped, twisted gurney flap may be formed in a tip of a blade provided in or on a hub of the centrifugal fan, so that noise may be effectively reduced, and efficiency increased. Further, the blade with the gurney flap may be easily formed integrally with the hub, enhancing productivity.

公开(公告)号：US11715812B2

公开(公告)日：2023-08-01

申请号：US17832221

申请日：2022-06-03

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon Kim ,  Hyunwoo Cho ,  Mihee Heo

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A display device includes a plurality of semiconductor light emitting diodes, first and second electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes, a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode, a dielectric layer disposed on the plurality of pair electrodes, and a chemical bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes. The chemical bond layer bonds the semiconductor light emitting diodes to the dielectric layer when a voltage applied to the plurality of pair electrodes is cut off after the plurality of semiconductor light emitting diodes are assembled on the dielectric layer.

公开(公告)号：US11437352B2

公开(公告)日：2022-09-06

申请号：US17254656

申请日：2018-07-05

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon Kim ,  Dohee Kim

IPC: H01L25/075 ,  H01L33/00 ,  H01L21/683 ,  H01L33/62

Abstract: Discussed are a display device, and a method of manufacturing the display device. The display device includes a substrate having a plurality of metal pads, and a semiconductor light-emitting element electrically connected to the plurality of metal pads through self-assembly. Specifically, each metal pad includes a bonding metal electrically connected to a conductive electrode of a respective semiconductor light-emitting element, and a coating layer encompassing the bonding metal.

公开(公告)号：US10971654B2

公开(公告)日：2021-04-06

申请号：US16894262

申请日：2020-06-05

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon Kim ,  Changseo Park ,  Bongchu Shim ,  Byoungkwon Cho ,  Hyunwoo Cho

IPC: H01L33/38 ,  H01L33/20 ,  H01L33/40 ,  H01L33/44 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: Discussed is a display device, including a semiconductor light emitting device and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed on an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction of the semiconductor light emitting device, wherein the first conductive semiconductor layer has a symmetrical shape with respect to at least one direction of the semiconductor light emitting device so that the first conductive electrode and the second conductive electrode are arranged at preset positions when the semiconductor light emitting device is accommodated into the receiving groove.