公开(公告)号：US10670536B2

公开(公告)日：2020-06-02

申请号：US16364098

申请日：2019-03-25

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Saravanan Paramasivam ,  Ankit Jain ,  Prasanti Uppaluri ,  Raghavan Konuru

IPC: G01N21/88 ,  G01N21/95 ,  G01N21/956

Abstract: Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.

公开(公告)号：US20150276618A1

公开(公告)日：2015-10-01

申请号：US14666942

申请日：2015-03-24

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Ankit Jain ,  Michael Lennek

IPC: G01N21/93 ,  H01L21/66 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8877 ,  G01N2201/063 ,  G01N2201/12 ,  H01L22/20

Abstract: Methods and systems for generating defect samples are provided. One method includes identifying a set of defects detected on a wafer having the most diversity in values of at least one defect attribute and generating different tiles for different defects in the set. The tiles define a portion of all values for the at least one attribute of all defects detected on the wafer that are closer to the values for the at least one attribute of their corresponding defects than the values for the at least one attribute of other defects. In addition, the method includes separating the defects on the wafer into sample bins corresponding to the different tiles based on their values of the at least one attribute, randomly selecting defect(s) from each of two or more of the sample bins, and creating a defect sample for the wafer that includes the randomly selected defects.

Abstract translation: 提供了生成缺陷样本的方法和系统。 一种方法包括识别在具有至少一个缺陷属性值的多样性最大的晶片上检测到的一组缺陷，并为该组中的不同缺陷生成不同的瓦片。 瓦片定义了在晶片上检测到的所有缺陷的至少一个属性的所有值的一部分，其比其它缺陷的至少一个属性的值更接近于其相应缺陷的至少一个属性的值。 另外，该方法包括：基于它们的至少一个属性值，从两个或多个样本仓中的每一个中随机选择缺陷，将晶片上的缺陷分离成与不同瓦片对应的样品仓，并创建 用于晶片的缺陷样品，其包括随机选择的缺陷。

公开(公告)号：US10338004B2

公开(公告)日：2019-07-02

申请号：US14666942

申请日：2015-03-24

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Ankit Jain ,  Michael Lennek

IPC: G01N21/93 ,  G01N21/95 ,  H01L21/66

Abstract: Methods and systems for generating defect samples are provided. One method includes identifying a set of defects detected on a wafer having the most diversity in values of at least one defect attribute and generating different tiles for different defects in the set. The tiles define a portion of all values for the at least one attribute of all defects detected on the wafer that are closer to the values for the at least one attribute of their corresponding defects than the values for the at least one attribute of other defects. In addition, the method includes separating the defects on the wafer into sample bins corresponding to the different tiles based on their values of the at least one attribute, randomly selecting defect(s) from each of two or more of the sample bins, and creating a defect sample for the wafer that includes the randomly selected defects.