公开(公告)号：US20210410329A1

公开(公告)日：2021-12-30

申请号：US17475026

申请日：2021-09-14

申请人： Intel Corporation

发明人： Jin YANG ,  Jimmy CHUANG ,  Mengqi LIU ,  Phil GENG ,  Ralph V. MIELE ,  Sandeep AHUJA ,  David SHIA

IPC分类号： H05K7/20 ,  H01L23/367

摘要： An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

公开(公告)号：US20210328370A1

公开(公告)日：2021-10-21

申请号：US17326148

申请日：2021-05-20

申请人： Intel Corporation

发明人： Phil GENG ,  Xiang LI ,  George VERGIS ,  Konika GANGULY

IPC分类号： H01R12/70 ,  H01R43/26 ,  H05K1/02

摘要： An apparatus is described. The apparatus includes a module having a connector along a center axis of the module. The module further includes a first set of semiconductor chips disposed in a first region of the module that resides between a first edge of the module and a first side of the connector, and, a second set of semiconductor chips disposed in a second region of the module that resides between a second opposite edge of the module and a second opposite side of the connector. A through hole does not exist between the first set of semiconductor chips and the first side of the connector nor between the second set of semiconductor chips and the second side of the connector. The module further includes a first through hole between a third edge of the connector and a third edge of the module and a second through hole between a fourth edge of the connector and a fourth edge of the module. The first and second through holes are to align with first and second studs that are to support a leaf spring when the leaf spring is bowed to press the connector into a printed circuit board.

公开(公告)号：US20200327912A1

公开(公告)日：2020-10-15

申请号：US16911168

申请日：2020-06-24

申请人： Intel Corporation

发明人： Xiang LI ,  Phil GENG ,  George VERGIS ,  Mani PRAKASH

IPC分类号： G11C5/04 ,  H05K1/18 ,  H05K3/34 ,  G06F1/18 ,  H05K3/40

摘要： A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

公开(公告)号：US20230307379A1

公开(公告)日：2023-09-28

申请号：US17703768

申请日：2022-03-24

申请人： Intel Corporation

发明人： Phil GENG ,  Patrick NARDI ,  Ravindranath V. MAHAJAN ,  Dingying David XU ,  Prasanna RAGHAVAN ,  John HARPER ,  Sanjoy SAHA ,  Yang JIAO

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L23/562 ,  H01L23/49816

摘要： Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

公开(公告)号：US20230273654A1

公开(公告)日：2023-08-31

申请号：US18195072

申请日：2023-05-09

申请人： Intel Corporation

发明人： Xiang LI ,  George VERGIS ,  Phil GENG

IPC分类号： G06F1/18

CPC分类号： G06F1/181 ,  H05K1/14

摘要： A standalone top cover retention mechanism can attach to the top of an array of tall (e.g., 2U) DIMMs to provide structural support. In one example, the DIMM cover is attached to two or more DIMMs without attaching to the chassis. The DIMM cover can mitigate shock and vibration related failures at the DIMM level without significant interference with platform thermal mechanical solutions.

公开(公告)号：US20230092972A1

公开(公告)日：2023-03-23

申请号：US18070433

申请日：2022-11-28

申请人： Intel Corporation

发明人： Phil GENG ,  Guixiang TAN ,  Yanbing SUN ,  Xiang LI ,  George VERGIS ,  Sanjoy K. SAHA

IPC分类号： H05K7/10 ,  H05K1/11 ,  H01L23/473 ,  H05K7/20 ,  H05K7/14

摘要： An apparatus is described. The apparatus includes a DIMM cooling assembly. The DIMM cooling assembly includes first and second heat spreaders to be respectively disposed on first and second sides of the DIMM's circuit board. The first and second sides having respective memory chips. The DIMM cooling assembly includes a heat dissipative structure. The DIMM's circuit board is to be disposed between the heat dissipative structure and a printed circuit board that the DIMM is to be plugged into. The DIMM cooling assembly includes fixturing elements to apply compressive forces toward the respective side edges of the DIMM's circuit board to the heat spreaders.

公开(公告)号：US20220208645A1

公开(公告)日：2022-06-30

申请号：US17696694

申请日：2022-03-16

申请人： Intel Corporation

发明人： Olaotan ELENITOBA-JOHNSON ,  Eric ERIKE ,  Jeffory L. SMALLEY ,  Ulises ENCARNACION ,  Ralph V. MIELE ,  Phil GENG ,  Sri Priyanka TUNUGUNTLA ,  Shaun G. IMMEKER

IPC分类号： H01L23/40

摘要： An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.