Disperse Dye Composition And Dyeing Method For Hydrophobic Fiber Material Using Same
    11.
    发明申请
    Disperse Dye Composition And Dyeing Method For Hydrophobic Fiber Material Using Same 有权
    分散染料组合物和染色方法用于疏水纤维材料使用相同

    公开(公告)号:US20140082860A1

    公开(公告)日:2014-03-27

    申请号:US14119626

    申请日:2012-06-07

    IPC分类号: C09B67/22

    摘要: An object of the present invention is provide a disperse dye composition that has the light fastness required of synthetic fiber materials for automotive interiors that are exposed to sunlight at high temperature and high humidity, and that has good blue, red, and yellow dyeability. This object is achieved by a mixed disperse dye composition comprising a blue disperse dye composition having a specific composition ratio of five specific types of disperse dyes, and other specific yellow and/or red disperse dyes. The invention makes it possible to provide a disperse dye composition having not only high fastness of each color but light fastness with a favorable balance of the three primary colors, with the dye properties of each color equal during dyeing, and good dye color reproducibility, as well as by a dyeing method using this dye.

    摘要翻译: 本发明的目的是提供一种分散染料组合物,其具有在高温高湿下暴露于阳光下的汽车内饰用合成纤维材料所需的耐光性,并且具有良好的蓝,红,黄染色性。 该目的通过混合分散染料组合物来实现,该混合分散染料组合物包含具有五种特定类型分散染料的特定组成比的蓝色分散染料组合物和其它特定的黄色和/或红色分散染料。 本发明使得可以提供一种分散染料组合物,其具有不仅具有各种颜色的牢度牢度,而且耐光性良好,具有三原色的良好平衡,每种颜色的染色性能在染色期间相同,并且染料色再现性良好,如 以及使用该染料的染色方法。

    BAG MEMBER FOR COMPRESSION PREBONDING, HOLDING TOOL FOR PRODUCING LAMINATED GLASS, AND DEVICE OF PRODUCING LAMINATED GLASS AND METHOD OF PRODUCING THE SAME
    12.
    发明申请
    BAG MEMBER FOR COMPRESSION PREBONDING, HOLDING TOOL FOR PRODUCING LAMINATED GLASS, AND DEVICE OF PRODUCING LAMINATED GLASS AND METHOD OF PRODUCING THE SAME 失效
    用于压缩预制的袋组件,用于生产层压玻璃的保持工具以及生产层压玻璃的装置及其生产方法

    公开(公告)号:US20130032291A1

    公开(公告)日:2013-02-07

    申请号:US13611972

    申请日:2012-09-12

    IPC分类号: B32B37/10

    摘要: A holding tool 2 for use in producing of laminated glass includes a frame 3, a bag member 4 and a supporting member 6b for suspending the bag member 4 from the frame 3. The bag member 4 is made of a film with flexibility and airtightness, is provided with a sealable opening and has evacuating ports 7a and 7b in the vicinity of an periphery of a flat shape thereof having the periphery sealed. The frame 3 has a first frame member 3w and a second frame member 3y opposing each other and disposed outside the periphery of the bag member 4, and the bag member 4 is suspended by the supporting member 6b movably against the frame 3 on a holding face formed at least by the first frame member 3w and the second frame member 3y inside an area formed by connecting ends of these frame members.

    摘要翻译: 用于制造夹层玻璃的保持工具2包括框架3,袋构件4和用于将袋构件4从框架3悬挂的支撑构件6b。袋构件4由具有柔性和气密性的膜制成, 设置有可密封的开口,并且在其周边密封了其扁平形状的周边附近具有排气口7a和7b。 框架3具有第一框架构件3w和第二框架构件3y,第一框架构件3w和第二框架构件3y彼此相对布置并且设置在袋构件4的周围的外侧,并且袋构件4被支撑构件6b悬挂在框架3上的保持面 至少由第一框架构件3w和第二框架构件3y形成在由这些框架构件的连接端形成的区域内。

    SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    13.
    发明申请
    SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    半导体晶体管及半导体器件制造方法

    公开(公告)号:US20120018726A1

    公开(公告)日:2012-01-26

    申请号:US13258884

    申请日:2010-03-23

    IPC分类号: H01L23/48 H01L21/768

    摘要: A semiconductor wafer in which a plurality of regions, designed to become semiconductor chips are provided in a matrix array with interposition of a dicing line(s) respectively separating the regions. The semiconductor wafer comprises: a plurality of test pads provided in an area(s) of the semiconductor wafer disposed between the semiconductor chips, inclusive of the dicing line(s); an inter-test pad interconnect(s) provided in parallel with the test pads in the area(s) of the semiconductor wafer disposed between the regions to become semiconductor chips; the inter-test pad interconnect(s) being connected to the test pads; and an inter-chip interconnect that interconnects at least two of the regions designed to become semiconductor chips; the inter-test pad interconnect being electrically connected to the inter-chip interconnect.

    摘要翻译: 设置成成为半导体芯片的多个区域的半导体晶片以分别分开该区域的切割线插入矩阵阵列中。 半导体晶片包括:多个测试焊盘,设置在设置在半导体芯片之间的半导体晶片的区域中,包括切割线; 与设置在所述半导体芯片之间的半导体晶片的区域中的测试焊盘平行设置的测试间互连(inter-test pad interconnect); 所述测试间互连连接到所述测试焊盘; 以及将设计成半导体芯片的区域中的至少两个互连的芯片间互连; 所述测试间互连件电连接到所述芯片间互连。

    System and method for analyzing defects on a wafer
    14.
    发明授权
    System and method for analyzing defects on a wafer 有权
    用于分析晶片缺陷的系统和方法

    公开(公告)号:US07983859B2

    公开(公告)日:2011-07-19

    申请号:US12236309

    申请日:2008-09-23

    申请人: Yoshiyuki Sato

    发明人: Yoshiyuki Sato

    IPC分类号: G01R31/00 G06F17/40

    CPC分类号: G01R31/2831

    摘要: A defect analyzer system having a program storage device storing instructions and an arithmetic unit executing the instructions. The system divides a defect analyzing region of a wafer into a plurality of grid squares and classifies the grid squares into a plurality of groups. The system then matches the defect information with the defect analyzing region. The defect information includes defect positions and sizes detected in the defect analyzing region. The system calculates a defect size distribution for each defect size in each of the groups, compares the defect size distribution and a predetermined estimation distribution for each of the groups, and calculates a difference. The system then compares the difference of each of the groups and a predetermined threshold value, extracts the group having the difference equal to or smaller than the predetermined threshold value, and outputs the defect information corresponding to the extracted group.

    摘要翻译: 一种具有存储指令的程序存储装置和执行指令的运算单元的缺陷分析器系统。 该系统将晶片的缺陷分析区域划分为多个网格正方形,并将网格正方形分成多个组。 然后,系统将缺陷信息与缺陷分析区域匹配。 缺陷信息包括在缺陷分析区域中检测到的缺陷位置和尺寸。 系统针对每个组中的每个缺陷尺寸计算缺陷尺寸分布,比较每个组的缺陷尺寸分布和预定的估计分布,并计算差值。 然后,系统比较每个组的差异和预定阈值,提取具有等于或小于预定阈值的差异的组,并输出与提取的组对应的缺陷信息。

    Plug-in unit-mounting structure and electronic apparatus
    16.
    发明授权
    Plug-in unit-mounting structure and electronic apparatus 有权
    插入式单元安装结构和电子设备

    公开(公告)号:US07889508B2

    公开(公告)日:2011-02-15

    申请号:US11715953

    申请日:2007-03-09

    IPC分类号: H05K7/10

    CPC分类号: H05K7/1461

    摘要: A plug-in unit-mounting structure which makes it possible to efficiently mount plug-in units having different sizes in all slots. PIUs of printed board type which are different in size are mounted using respective mounting frames associated therewith. Box-shaped PIUs are also mounted using respective mounting frame associated therewith. However, no guide rail is provided on the metal shelf per se, for guiding each PIU for mounting the same therein.

    摘要翻译: 一种插入式单元安装结构,其可以在所有槽中有效地安装具有不同尺寸的插入式单元。 使用与其相关联的各个安装框架来安装尺寸不同的印刷电路板类型的PIU。 箱形PIU也使用与其相关联的相应安装框架来安装。 然而,金属架本身上没有设置导轨,用于引导每个PIU以将其固定在其中。

    CASE OF AN ELECTRONIC DEVICE
    17.
    发明申请
    CASE OF AN ELECTRONIC DEVICE 有权
    电子设备案例

    公开(公告)号:US20100103633A1

    公开(公告)日:2010-04-29

    申请号:US12607257

    申请日:2009-10-28

    IPC分类号: H05K7/00

    CPC分类号: H05K7/1418

    摘要: A case for an electronic device includes a printed circuit board; a frame capable of storing the printed circuit board; a back board equipped on a back side of the frame, and including a connector for connecting the printed circuit board; rail holders equipped in predetermined positions of the frame and extending from a front side of the case to the back board; and guide rails engaged with the rail holders respectively and including engagement parts capable of engaging with the rail holders respectively, and holding parts for holding both ends of the frame, and extending in accordance with the rail holders, respectively.

    摘要翻译: 电子设备的壳体包括印刷电路板; 能够存储印刷电路板的框架; 设置在所述框架的背面的背板,并且包括用于连接所述印刷电路板的连接器; 轨道架设在框架的预定位置并从壳体的前侧延伸到后板; 以及与导轨座分别啮合的导轨,包括能够分别与导轨座分别接合的接合部分和用于保持框架两端的保持部分,并分别根据导轨架延伸。

    Method for designing mold, mold and molded product

    公开(公告)号:US07584015B2

    公开(公告)日:2009-09-01

    申请号:US11596537

    申请日:2005-05-31

    摘要: A molded product from a mold, the mold for molding a molded product in a desired shape can be designed with high precision by correcting a shape change of the molded product. A mold in which use surfaces of an upper mold and a lower mold are formed to be design curved surfaces of an optical lens is prepared. A curved surface shape of the optical lens molded from this mold is measured, and a measured value is approximated by equation (1). The curved surface of the optical lens specified by the equation and a design curved surface are compared to obtain an error between both the curved surfaces. Information corresponding to the error is used as correction information, and the use surfaces in the upper mold and the lower mold are corrected and designed. Z = C ⁢ ⁢ ρ 2 1 + 1 - ( 1 + K ) ⁢ C 2 ⁢ ρ 2 + ∑ i = 2 n ⁢ A 2 ⁢ i ⁢ ρ 2 ⁢ i ( 1 )

    Method for Designing Mold, Mold and Molded Product

    公开(公告)号:US20080042307A1

    公开(公告)日:2008-02-21

    申请号:US11596537

    申请日:2005-05-31

    IPC分类号: B29C33/38

    摘要: On an occasion of molding a molded product from a mold, the mold for molding a molded product in a desired shape can be designed with high precision by correcting a shape change of the molded product. A mold 10 in which use surfaces 16 of an upper mold 11 and a lower mold 12 are formed to be design curved surfaces of an optical lens is prepared. A curved surface shape of the optical lens molded from this mold is measured, and a measured value is approximated by equation (1) which is an equation of an aspherical surface to specify a curved surface of the above-described optical lens as an aspherical surface. The curved surface of the above-described optical lens specified by the equation of the aspherical surface and a design curved surface of the above-described optical lens are compared to obtain an error between both the curved surfaces. Information corresponding to the error is used as correction information (entire shape correction information, local shape correction information), and the use surfaces in the upper mold and the lower mold in the above-described mold are corrected and designed. [ Mathematical ⁢   ⁢ expression ⁢   ⁢ 14 ]   Z = C ⁢   ⁢ ρ 2 1 + 1 - ( 1 + K ) ⁢ C 2 ⁢ ρ 2 + ∑ i = 2 n ⁢ A 2 ⁢ i ⁢ ρ 2 ⁢ i ( 1 )