公开(公告)号：US07812703B2

公开(公告)日：2010-10-12

申请号：US11386733

申请日：2006-03-23

Applicant: Gregory A. Carlson ,  John S. Foster ,  Donald C. Liu ,  Douglas L. Thompson

Inventor： Gregory A. Carlson ,  John S. Foster ,  Donald C. Liu ,  Douglas L. Thompson

IPC: H18H71/18

CPC classification number: H01H1/0036 ,  C23C28/021 ,  C23C28/023 ,  C25D3/562 ,  C25D5/022 ,  C25D5/54 ,  H01H2001/0047 ,  H01H2061/006

Abstract: A material for forming a conductive structure for a MEMS device is described, which is an alloy containing about 0.01% manganese and the remainder nickel. Data shows that the alloy possesses advantageous mechanical and electrical properties. In particular, the sheet resistance of the alloy is actually lower than the sheet resistance of the pure metal. In addition, the alloy may have superior creep and higher recrystallization temperature than the pure metal. It is hypothesized that these advantageous material properties are a result of the larger grain structure existing in the NiMn alloy film compared to the pure nickel metal film. These properties may make the alloy appropriate for applications such as MEMS thermal electrical switches for telecommunications applications.

Abstract translation: 描述了一种用于形成用于MEMS器件的导电结构的材料，其是含有约0.01％锰及其余镍的合金。 数据显示，该合金具有有利的机械和电学性能。 特别地，合金的薄层电阻实际上低于纯金属的薄层电阻。 此外，与纯金属相比，合金具有优异的蠕变和更高的再结晶温度。 假设这些有利的材料性质是与纯镍金属膜相比NiMn合金膜中存在较大的晶粒结构的结果。 这些性能可以使合金适用于诸如用于电信应用的MEMS热电开关的应用。

公开(公告)号：US20080191303A1

公开(公告)日：2008-08-14

申请号：US11705739

申请日：2007-02-14

Applicant: Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

Inventor： Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

IPC: H01L31/058 ,  H01L21/00

CPC classification number: H01H1/0036 ,  H01H61/04 ,  H01H2001/0047 ,  H01H2001/0078 ,  H01H2061/006 ,  H01H2061/008

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

Abstract translation: 公开了一种分离的MEMS热致动器，其对热致动器的悬臂梁中的蠕变基本上不敏感。 在分离的MEMS热致动器中，嵌入的悬臂式驱动梁形成在同一平面上，但与被动梁分开，间隙小。 由于嵌入的悬臂驱动梁和被动梁不直接耦合，镶嵌悬臂驱动梁的静止位置的任何变化可能不会传递到被动梁，如果变化的幅度小于间隙的大小 。

公开(公告)号：US20070269934A1

公开(公告)日：2007-11-22

申请号：US11434768

申请日：2006-05-17

Applicant: Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

Inventor： Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

IPC: H01L21/00

CPC classification number: B81C99/004

Abstract: A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.

Abstract translation: 描述了一种用于提供对设备晶片上的特征的访问并位于封装区域外部的方法。 该方法包括在盖晶片中形成空腔，将盖晶片与器件晶片对准，使得空腔基本上位于特征上方，并且从盖晶片的底表面基本上均匀地移除材料，直到孔形成在 在器件晶圆上的特征之上。 通过以大致均匀的方式从盖晶片去除材料，避免了现有技术的锯切过程（例如对准和碎屑产生）的困难。

公开(公告)号：US20120015456A1

公开(公告)日：2012-01-19

申请号：US12232298

申请日：2008-09-15

Applicant: Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

Inventor： Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

IPC: H01L21/56 ,  H01L21/66

CPC classification number: B81C99/004

Abstract: A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.

Abstract translation: 描述了一种用于提供对设备晶片上的特征的访问并位于封装区域外部的方法。 该方法包括在盖晶片中形成空腔，将盖晶片与器件晶片对准，使得空腔基本上位于特征上方，并且从盖晶片的底表面基本上均匀地移除材料，直到孔形成在 在器件晶圆上的特征之上。 通过以大致均匀的方式从盖晶片去除材料，避免了现有技术的锯切过程（例如对准和碎屑产生）的困难。

公开(公告)号：US20090181488A1

公开(公告)日：2009-07-16

申请号：US12382142

申请日：2009-03-10

Applicant: Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

Inventor： Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

IPC: H01L21/306

CPC classification number: H01H1/0036 ,  H01H61/04 ,  H01H2001/0047 ,  H01H2001/0078 ,  H01H2061/006 ,  H01H2061/008

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

公开(公告)号：US20080006850A1

公开(公告)日：2008-01-10

申请号：US11482944

申请日：2006-07-10

Applicant: Kimon Ribnicek ,  Gregory A. Carlson ,  Paulo Silveira da Motta ,  Jian Zhao

Inventor： Kimon Ribnicek ,  Gregory A. Carlson ,  Paulo Silveira da Motta ,  Jian Zhao

IPC: H01L29/76 ,  H01L21/20

CPC classification number: H01L21/76898 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C2201/0181

Abstract: A method for forming through wafer vias in a substrate uses a Cr/Au seed layer to plate the bottom of a blind trench formed in the front side of a substrate. Thereafter, a reverse plating process uses a forward current to plate the bottom and sides of the blind hole, and a reverse current to de-plate material in or near the top. Using the reverse pulse plating technique, the plating proceeds generally from the bottom of the blind hole to the top. To form the through wafer via, the back side of the substrate is ground or etched away to remove material up to and including the dead-end wall of the blind hole.

Abstract translation: 用于在衬底中形成晶片通孔的方法使用Cr / Au种子层来平坦化形成在衬底前侧的盲沟的底部。 此后，反向电镀工艺使用正向电流来平板盲孔的底部和侧面，以及在顶部中或附近的去镀材料的反向电流。 使用反向脉冲电镀技术，电镀通常从盲孔的底部到顶部。 为了形成贯通晶片通孔，将衬底的背面研磨或蚀刻掉以去除直到并包括盲孔的死端壁的材料。

公开(公告)号：US20110295229A1

公开(公告)日：2011-12-01

申请号：US12801162

申请日：2010-05-26

Applicant: Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Steven S. Hovey ,  Paul J. Rubel

Inventor： Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Steven S. Hovey ,  Paul J. Rubel

IPC: A61M5/168 ,  B23P15/00 ,  A61M5/142 ,  F04B53/10

CPC classification number: F04B43/043

Abstract: A micromechanical pumping system is formed on a substrate surface. The pumping system uses a pumping element which pumps a fluid through valves which move in a plane substantially parallel to the substrate surface. An electromagnetic actuating mechanism may also be fabricated on the surface of the substrate. Magnetic flux produced by a coil around a permeable core may be coupled to a permeable member affixed to a pumping element. The permeable member and pumping element may be configured to move in a plane parallel to the substrate. The electromagnetic actuating mechanism gives the pumping system a large throw and substantial force, such that the fluid pumped by the pumping system may be pumped through a transdermal cannula to deliver a therapeutic substance to the tissue underlying the skin of a patient.

Abstract translation: 在基板表面上形成微机械泵送系统。 泵送系统使用泵送元件，该元件通过在基本上平行于衬底表面的平面中移动的阀来泵送流体。 也可以在基板的表面上制造电磁致动机构。 线圈围绕可渗透芯体产生的磁通可以耦合到固定到泵送元件的可渗透构件。 可渗透构件和泵送元件可以构造成在平行于衬底的平面中移动。 电磁致动机构使泵送系统产生大的冲击力和相当大的力，使得由泵送系统泵送的流体可以泵送通过透皮插管，以将治疗物质递送到患者皮肤下方的组织。

公开(公告)号：US07759152B2

公开(公告)日：2010-07-20

申请号：US12382142

申请日：2009-03-10

Applicant: Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

Inventor： Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

IPC: H01L21/00

CPC classification number: H01H1/0036 ,  H01H61/04 ,  H01H2001/0047 ,  H01H2001/0078 ,  H01H2061/006 ,  H01H2061/008

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

Abstract translation: 公开了一种分离的MEMS热致动器，其对热致动器的悬臂梁中的蠕变基本上不敏感。 在分离的MEMS热致动器中，嵌入的悬臂式驱动梁形成在同一平面上，但与被动梁分开，间隙小。 由于嵌入的悬臂驱动梁和被动梁不直接耦合，镶嵌悬臂驱动梁的静止位置的任何变化可能不会传递到被动梁，如果变化的幅度小于间隙的大小 。

公开(公告)号：US07550778B2

公开(公告)日：2009-06-23

申请号：US11434768

申请日：2006-05-17

Applicant: Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

Inventor： Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

IPC: H01L29/207

CPC classification number: B81C99/004

Abstract: A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.

Abstract translation: 描述了一种用于提供对设备晶片上的特征的访问并位于封装区域外部的方法。 该方法包括在盖晶片中形成空腔，将盖晶片与器件晶片对准，使得空腔基本上位于特征上方，并且从盖晶片的底表面基本均匀地移除材料，直到孔形成在 在器件晶圆上的特征之上。 通过以大致均匀的方式从盖晶片去除材料，避免了现有技术的锯切过程（例如对准和碎屑产生）的困难。