公开(公告)号：US09634120B2

公开(公告)日：2017-04-25

申请号：US14610410

申请日：2015-01-30

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Kyoung Ik Cho ,  Jae Bon Koo ,  Chan Woo Park ,  Bock Soon Na ,  Sang Seok Lee ,  Sang Chul Lim ,  Soon-Won Jung ,  Hye Yong Chu

IPC: H01L29/10 ,  H01L29/66 ,  H01L29/786 ,  H01L27/12 ,  H01L21/3105

CPC classification number: H01L29/78603 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31144 ,  H01L27/1218 ,  H01L27/1266 ,  H01L29/66742

Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.