LIGHT-EMITTING STRUCTURE
    11.
    发明申请

    公开(公告)号:US20210183942A1

    公开(公告)日:2021-06-17

    申请号:US17170407

    申请日:2021-02-08

    摘要: A light-emitting device, includes a substrate with a top surface; a first light-emitting structure unit and a second light-emitting structure unit separately formed on the top surface and adjacent to each other, and wherein the first light-emitting structure unit includes a first sidewall and a second sidewall; a trench between the first and the second light-emitting structure units; and an electrical connection arranged on the first sidewall and the second light-emitting structure unit, and electrically connecting the first light-emitting structure unit and the second light-emitting structure unit; wherein the first sidewall connects to the top surface; wherein the first sidewall faces the second light-emitting structure units, and the second sidewall is not between the first light-emitting structure unit and the second light-emitting structure unit; and wherein the second sidewall is steeper than the first sidewall.

    LIGHT-EMITTING DEVICE
    12.
    发明申请

    公开(公告)号:US20180315889A1

    公开(公告)日:2018-11-01

    申请号:US16030437

    申请日:2018-07-09

    摘要: A light-emitting device includes: a rectangular shape with a first side, a second side opposite to the first side, and a third side connecting the first side and the second side; a light-emitting stack, comprising a lower semiconductor layer, an upper semiconductor layer, and an active layer between the lower semiconductor layer and the upper semiconductor layer; a first electrode formed on the lower semiconductor layer, comprising a first electrode pad and a first extension electrode; a second electrode formed on the upper semiconductor layer, comprising a second electrode pad and a second extension electrode; and a first current blocking layer formed between the lower semiconductor layer and the first electrode pad, wherein the first current blocking layer comprises a top surface and side surfaces; wherein the first electrode pad covers the top surface and the side surfaces of the first current blocking layer and contacts the lower semiconductor layer.

    LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF
    15.
    发明申请
    LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF 有权
    发光装置及其制造方法

    公开(公告)号:US20140077238A1

    公开(公告)日:2014-03-20

    申请号:US14089591

    申请日:2013-11-25

    IPC分类号: H01L27/15

    摘要: A light-emitting device includes: a carrier; a light-emitting structure formed on the carrier, wherein the light-emitting structure has a first surface facing the carrier, a second surface opposite to the first surface, and an active layer between the first surface and the second surface; a plurality of first trenches extended from the first surface and passing through the active layer so a plurality of light-emitting units is defined; and a plurality of second trenches extended from the second surface and passing through the active layer of each of the plurality of light-emitting units.

    摘要翻译: 发光装置包括:载体; 形成在所述载体上的发光结构,其中所述发光结构具有面向所述载体的第一表面,与所述第一表面相对的第二表面,以及在所述第一表面和所述第二表面之间的有源层; 从所述第一表面延伸并穿过所述有源层的多个第一沟槽,以限定多个发光单元; 以及从所述第二表面延伸并穿过所述多个发光单元中的每一个的有源层的多个第二沟槽。

    Light Emitting Device with Reflective Electrode

    公开(公告)号:US20180069155A1

    公开(公告)日:2018-03-08

    申请号:US15810585

    申请日:2017-11-13

    IPC分类号: H01L33/40 H01L33/22

    摘要: A light-emitting device, comprises a semiconductor light emitting stack; and an electrode on the semiconductor light emitting stack, the electrode comprising an adhesion layer, comprising chromium (Cr) or rhodium (Rh); a mirror layer, formed on the adhesion layer and comprising silver (Ag) or aluminum (Al); a barrier layer, formed on the mirror layer and comprising a first pair of metal layers, wherein the first pair of metal layers comprises a first metal layer and a second metal layer different from the first metal layer; and a bonding layer, formed on the barrier layer and comprising gold (Au), wherein from a cross-sectional view, the barrier layer fully covers the mirror layer and the adhesion layer.

    LIGHT-EMITTING DEVICE
    17.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20160343909A1

    公开(公告)日:2016-11-24

    申请号:US15228529

    申请日:2016-08-04

    IPC分类号: H01L33/22 H01L33/20 H01L33/38

    摘要: A light-emitting device includes: a light-emitting stack including a first side, a second side opposite to the first side, a third side connecting the first side and the second side, and an upper surface between the first side and the second side; a first electrode pad formed on the upper surface; a second electrode pad formed on the upper surface, wherein the first electrode pad is closer to the first side than the second electrode pad; and a first extension electrode including a first section extended from the first electrode pad in a direction away from the third side, and a second section connecting to the first section and perpendicular to the first side; wherein a distance between the first electrode pad and the third side is smaller than a distance between the second electrode pad and the third side.

    摘要翻译: 发光装置包括:发光堆叠,包括第一侧,与第一侧相对的第二侧,连接第一侧和第二侧的第三侧以及第一侧和第二侧之间的上表面 ; 形成在上表面上的第一电极焊盘; 形成在所述上表面上的第二电极焊盘,其中所述第一电极焊盘比所述第二电极焊盘更靠近所述第一侧; 以及第一延伸电极,其包括从远离所述第三侧的方向从所述第一电极焊盘延伸的第一部分,以及连接到所述第一部分并垂直于所述第一侧的第二部分; 其中所述第一电极焊盘和所述第三侧之间的距离小于所述第二电极焊盘和所述第三侧之间的距离。

    LIGHT EMITTING DEVICE WITH REFLECTIVE ELECTRODE
    18.
    发明申请
    LIGHT EMITTING DEVICE WITH REFLECTIVE ELECTRODE 有权
    具有反射电极的发光装置

    公开(公告)号:US20160197241A1

    公开(公告)日:2016-07-07

    申请号:US15071978

    申请日:2016-03-16

    IPC分类号: H01L33/40 H01L33/22

    摘要: A light-emitting device includes a semiconductor light emitting stack; an electrode on the semiconductor light emitting stack, the electrode including a mirror layer, an adhesion layer inserted between the mirror layer and the semiconductor light emitting stack, a bonding layer; and a plurality of pits between the bonding layer and the semiconductor light emitting stack, wherein one of the plurality of pits is not filled up by the adhesion layer.

    摘要翻译: 发光器件包括半导体发光堆叠; 所述电极包括镜面层,插入在所述镜面层和所述半导体发光层之间的粘合层,接合层; 以及在所述接合层和所述半导体发光叠层之间的多个凹坑,其中所述多个凹坑中的一个未被所述粘合层填充。