Abstract:
Disclosed are a heterogeneously integrated optical modulator and a manufacturing method thereof. The modulator includes a substrate having a trench, an input waveguide disposed at one side of the trench, an output waveguide disposed at the other side of the trench, a first Mach-Zehnder interferometer including first branch waveguides disposed between the input waveguide and the output waveguide and a heater disposed on one of the first branch waveguides, and second Mach-Zehnder interferometers connected to each of the first branch waveguides.
Abstract:
Provided is an optical transmitter module. The optical transmitter module includes a substrate, a ground layer disposed on the substrate, an electro-absorption modulated laser (EML) chip disposed on the ground layer to generate an modulated optical signal, a ground structure disposed on the EML chip and electrically connected to the ground layer, a matching resistor disposed on the ground structure, and a first bonding wire disposed between the EML chip and the matching resistor to electrically connect the EML chip to the matching resistor.
Abstract:
Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.
Abstract:
Provided herein is a semiconductor optical device, including a waveguide including lattices buried therein and having a buried hetero (BH) structure formed in an optical oscillation region in which single mode light is oscillated, a waveguide having a deep ridge structure formed in an optical modulation region, and a passive waveguide formed in a mode transition region interposed between the optical oscillation region and the optical modulation region, formed as a connecting structure of the waveguide having the BH structure extending from the optical oscillation region and the waveguide having the deep ridge structure extending from the optical modulation region, and inducing evanescent optical coupling, wherein a width of the waveguide having the BH structure in the mode transition region is smaller than a width of the waveguide having the deep ridge structure in the optical modulation region.
Abstract:
A method of operating a wavelength swept source apparatus includes generating a single mode light, and generating a basic optical comb including light rays having identical frequency differences with adjacent light rays by modulating the generated single mode light. The method further includes generating other optical combs that include the same number of light rays as that of light rays of the optical comb that has a frequency band different from that of the basic optical comb, and is distributed in a frequency band wider than that in which the basic optical comb is distributed, by modulating the light rays of the basic optical comb. The light rays of the basic optical comb and the light rays included in the other optical combs are sequentially emitted according to frequencies of the light rays of the basic optical comb and the light rays included in the other optical combs.
Abstract:
Provided is a transistor outline (TO)-CAN type optical module and an optical transmission apparatus including the same. The optical module includes a stem, a thermo-electric cooler (TEC) on the stem, a first sub-mount on the TEC, an optical element on the first sub-mount, a plurality of electrode lead wirings inserted from an outside to an inside of the stem and disposed adjacent to the TEC and the optical element, a second sub-mount between the electrode lead wirings and the optical element, radio frequency (RF) transmission lines on the second sub-mount, a plurality of bonding wires connecting the RF transmission lines and the optical element, and the RF transmission lines and the electrode lead wirings, and an impedance matching unit disposed around the RF transmission lines and the electrode lead wirings, and controlling impedances of the RF transmission lines and the electrode lead wires.