公开(公告)号：US20200340758A1

公开(公告)日：2020-10-29

申请号：US16926006

申请日：2020-07-10

Applicant: DENSO CORPORATION

Inventor： Takuya FUSE ,  Toru OKAMURA ,  Kuniyoshi TANIOKA

IPC: F28D20/00 ,  B60H1/04 ,  B60H1/32 ,  F01P7/14 ,  F01P3/04

Abstract: A heat storage device includes a heat storage, a first flow passage, a second flow passage and a flow rate regulator. The heat storage stores heat released from coolant. The first flow passage is placed in a circulation path that conducts the coolant. The heat storage is installed in the first flow passage. The second flow passage conducts the coolant and bypasses the heat storage. The flow rate regulator adjusts a flow rate ratio that is a ratio of a second flow rate of the coolant, which flows in the second flow passage, relative to a first flow rate of the coolant, which flows in the first flow passage. The flow rate regulator reduces the first flow rate when a temperature of the coolant is decreased.

公开(公告)号：US20180120036A1

公开(公告)日：2018-05-03

申请号：US15800270

申请日：2017-11-01

Applicant: DENSO CORPORATION ,  Qualtec. Co., Ltd.

Inventor： Toru OKAMURA ,  Kenichi NARA ,  Hirokazu SHIKATA ,  Hiroshi IHARA ,  Satoshi OYA ,  Yukari FUCHIGAMI ,  Toshiyuki YOSHIKATA

IPC: F28D20/02 ,  C23C18/16 ,  C25D7/00 ,  C25D5/34

CPC classification number: F28D20/023 ,  C09K5/063 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/2013 ,  C23C18/285 ,  C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  C25D5/34 ,  C25D7/00 ,  Y02E60/145

Abstract: A latent heat storage material includes a latent heat storage member formed of an organic compound, and a metallic seamless capsule encapsulating the latent heat storage member. A method for manufacturing the latent heat storage material includes preparing a grain of the latent heat storage member, supporting a powder on the latent heat storage member, conducting an electroless plating to form a first plating layer of the metallic seamless capsule on a surface of the latent heat storage member, and conducting an electrolytic plating to form a second plating layer of the metallic seamless capsule on a surface of the first plating layer.