公开(公告)号：US11357132B2

公开(公告)日：2022-06-07

申请号：US16922177

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC: H05K7/20 ,  H05K7/14 ,  G02B6/42 ,  H01R13/518

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

公开(公告)号：US11191185B2

公开(公告)日：2021-11-30

申请号：US16749254

申请日：2020-01-22

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rakesh Chopra ,  Mandy Hin Lam ,  M. Baris Dogruoz ,  Joel Richard Goergen

IPC: H05K7/20

Abstract: In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.

公开(公告)号：US20210231890A1

公开(公告)日：2021-07-29

申请号：US16922383

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC: G02B6/42 ,  H01R13/518

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

公开(公告)号：US09585283B2

公开(公告)日：2017-02-28

申请号：US13728115

申请日：2012-12-27

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  Mandy Hin Lam ,  Frank Jun ,  Hong Tran Huynh

IPC: H01R13/62 ,  H05K7/14 ,  H01R13/629

CPC classification number: H05K7/1489 ,  H01R13/62933 ,  H01R13/62938 ,  H01R13/62966 ,  H01R13/62972 ,  H01R13/62977 ,  Y10T29/49117

Abstract: A high insertion force ejector is provided. The high insertion force ejector includes an ejector mounting base, a pressure bar-ejector tooth, a first cam, and a second cam. The pressure bar-ejector tooth is connected to the ejector mounting base. A lever handle is operatively connected to the pressure bar-ejector and the ejector mounting base. The first cam and the second cam are operatively connected to the pressure bar-ejector tooth and the lever handle.

Abstract translation: 提供了高插入力的喷射器。 高插入力推出器包括顶出器安装座，压杆推出器齿，第一凸轮和第二凸轮。 压杆推出器齿连接到喷射器安装座。 杠杆手柄可操作地连接到压力杆 - 喷射器和喷射器安装座。 第一凸轮和第二凸轮可操作地连接到压杆推出器齿和杠杆手柄。

公开(公告)号：US20150124425A1

公开(公告)日：2015-05-07

申请号：US14072888

申请日：2013-11-06

Applicant: Cisco Technology, Inc.

Inventor： Jing An ,  Luli Gong ,  Hua Yang ,  Hailong Zhang ,  Dewen Xu ,  Susan Huang ,  Mandy Hin Lam

IPC: H05K9/00

CPC classification number: H05K9/0015

Abstract: An apparatus may be provided. The apparatus may comprise a core and a covering material disposed on a portion of the core. At least one opening may be disposed in the core. The at least one opening may expose at least one interior surface on the core. The at least one interior surface may be devoid of the covering material.

Abstract translation: 可以提供一种装置。 该装置可以包括设置在芯的一部分上的芯和覆盖材料。 至少一个开口可以设置在芯中。 至少一个开口可以暴露在芯上的至少一个内表面。 至少一个内表面可以没有覆盖材料。

公开(公告)号：US20150062820A1

公开(公告)日：2015-03-05

申请号：US14018189

申请日：2013-09-04

Applicant: Cisco Technology, Inc.

Inventor： Mandy Hin Lam ,  Hong Tran Huynh ,  M. Baris Dogruoz

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.

Abstract translation: 提供了一种装置，其包括平面导热材料，其包括构造成在第一集成电路和第一散热器之间传导热量的第一散热器传导部分，第二散热器传导部分，被配置为在第二集成电路和 第二散热器和热桥部分，其构造成在第一散热器传导部分和第二散热器传导部分之间传导热量，使得热桥部分允许对第一集成电路和第二散热器传导部分之间的高度差进行挠曲补偿 第二集成电路。

公开(公告)号：US20220225537A1

公开(公告)日：2022-07-14

申请号：US17145816

申请日：2021-01-11

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mark Nowell ,  M. Baris Dogruoz ,  Mandy Hin Lam ,  Rakesh Chopra

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/44

Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

公开(公告)号：US11184994B2

公开(公告)日：2021-11-23

申请号：US15983305

申请日：2018-05-18

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mandy Hin Lam ,  Vic Hong Chia ,  M. Baris Dogruoz

IPC: H05K7/20

Abstract: According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.

公开(公告)号：US11122705B2

公开(公告)日：2021-09-14

申请号：US16246914

申请日：2019-01-14

Applicant: Cisco Technology, Inc.

Inventor： M. Baris Dogruoz ,  Mandy Hin Lam ,  Pirooz Tooyserkani

IPC: H05K7/20 ,  H04B1/06

Abstract: An apparatus includes a cage structure and a cooling plate configured to contain a cooling liquid to cool the cage structure. The cage structure has a front end, a top surface adjacent to the front end, a first opening at the front end, and a second opening on the top surface. The first opening is configured to receive a pluggable optical module. The cooling plate is disposed on top of the second opening of the cage structure. The apparatus may further include a deformable pad disposed at the second opening of the cage structure and beneath the cooling plate.

公开(公告)号：US20200229321A1

公开(公告)日：2020-07-16

申请号：US16246914

申请日：2019-01-14

Applicant: Cisco Technology, Inc.

Inventor： M. Baris Dogruoz ,  Mandy Hin Lam ,  Pirooz Tooyserkani

IPC: H05K7/20

Abstract: An apparatus includes a cage structure and a cooling plate configured to contain a cooling liquid to cool the cage structure. The cage structure has a front end, a top surface adjacent to the front end, a first opening at the front end, and a second opening on the top surface. The first opening is configured to receive a pluggable optical module. The cooling plate is disposed on top of the second opening of the cage structure. The apparatus may further include a deformable pad disposed at the second opening of the cage structure and beneath the cooling plate.