IN-EAR ACTIVE NOISE REDUCTION EARPHONE

    公开(公告)号:US20130315412A1

    公开(公告)日:2013-11-28

    申请号:US13864865

    申请日:2013-04-17

    申请人: Bose Corporation

    IPC分类号: G10K11/178

    摘要: An active noise reduction earphone. The earphone includes structure for positioning and retaining the earphone in the ear of a user without a headband, active noise reduction circuitry including an acoustic driver with a nominal diameter greater than 10 mm oriented so that a line parallel to, or coincident with, an axis of the acoustic driver and that intersects a centerline of the nozzle intersects the centerline of the nozzle at angle θ>±30 degrees. A microphone is positioned adjacent an edge of the acoustic driver. The earphone is configured so that a portion of the acoustic driver is within the concha of a user and another portion of the acoustic driver is outside the concha of the user when the earphone is in position. An opening coupling the nozzle to the environment includes impedance providing structure in the opening.

    Audio Device
    15.
    发明申请

    公开(公告)号:US20220086552A1

    公开(公告)日:2022-03-17

    申请号:US17538597

    申请日:2021-11-30

    申请人: Bose Corporation

    IPC分类号: H04R1/10

    摘要: An audio device with a body configured to be worn on or abutting an outer ear of a user, wherein the body is configured to contact at least one of the outer ear and the portion of the head that abuts the outer ear, at two separate spaced contact locations, and wherein the body is compliant at a body portion that defines one of the contact locations. The device also has an acoustic module carried by the body and configured to locate a sound-emitting opening anteriorly of and proximate the user's ear canal opening when the body is worn on or abutting the ear of the user.

    Audio device
    16.
    发明授权
    Audio device 审中-公开

    公开(公告)号:US10674244B2

    公开(公告)日:2020-06-02

    申请号:US15901076

    申请日:2018-02-21

    申请人: Bose Corporation

    IPC分类号: H04R1/10

    摘要: An audio device with a body configured to be worn on or abutting an outer ear of a user, wherein the body is configured to contact at least one of the outer ear and the portion of the head that abuts the outer ear, at two separate spaced contact locations, and wherein the body is compliant at a body portion that defines one of the contact locations. The device also has an acoustic module carried by the body and configured to locate a sound-emitting opening anteriorly of and proximate the user's ear canal opening when the body is worn on or abutting the ear of the user.

    Headphone joint
    18.
    发明授权

    公开(公告)号:US10271125B2

    公开(公告)日:2019-04-23

    申请号:US15874108

    申请日:2018-01-18

    申请人: Bose Corporation

    IPC分类号: H04R1/00 H04R1/10 H04R5/033

    摘要: A headphone with a headband and at least one earcup. The at least one earcup is movably coupled to the headband by a joint that is structured to allow rotation of the earcup relative to the headband about two mutually perpendicular axes, and translation along one of these axes.

    Headphones with External Pressure Equalization Path

    公开(公告)号:US20180338193A1

    公开(公告)日:2018-11-22

    申请号:US15597567

    申请日:2017-05-17

    申请人: Bose Corporation

    IPC分类号: H04R1/10

    摘要: An earphone includes a housing enclosing an acoustic transducer and having a front volume. The housing includes a nozzle that extends the front volume to at least an entrance of a wearer's ear canal, and a groove in an outer surface of the housing, extending at least along a length of the nozzle. A flexible ear tip is configured to attach to the housing. When the flexible ear tip attaches to the housing, the groove and a portion of an inner surface of the ear tip together form a port that acoustically couples the front volume with an environment external to the earphone.