LED backlight structure and manufacturing method thereof

    公开(公告)号:US11262618B1

    公开(公告)日:2022-03-01

    申请号:US17212832

    申请日:2021-03-25

    Abstract: The present disclosure relates to an LED backlight structure having a backlight side and a light outgoing side opposite to each other, including: an LED array on a transparent substrate; a transparent encapsulation layer on a side of the transparent substrate with the LED array, and configured to encapsulate the LED array; wherein the LED array is configured to emit light, the LED backlight structure further includes: a reflection layer on a backlight side of the transparent substrate and configured to reflect light to the light outgoing side; and a first microstructure layer on the light outgoing side of the transparent substrate and the LED array, wherein the first microstructure layer is configured to scatter light incident on a surface of the first microstructure layer, so that a part of light passes through the first microstructure layer, and the rest of light is reflected by the first microstructure layer.

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