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公开(公告)号：US20240431143A1
公开(公告)日：2024-12-26
申请号：US17907489
申请日：2021-12-24
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xiaohu Li , Lu Wang , Zhiqiang Jiao , Liangliang Kang , Xiaoyun Liu , Peng Wang
IPC: H10K59/122 , H10K59/131 , H10K59/80
Abstract: An array substrate is provided. The array substrate includes a plurality of subpixels. A respective subpixel of the plurality of subpixels includes a first transistor. The first transistor includes a gate electrode; a first electrode on the gate electrode; a semiconductor material layer on a side of the first electrode away from the gate electrode; a second electrode on a side of the semiconductor material layer away from the first electrode; an organic layer on a side of the second electrode away from the semiconductor material layer; and a third electrode on a side of the organic layer away from the second electrode. An orthographic projection of the second electrode on a base substrate at least partially overlaps with an orthographic projection of the organic layer on the base substrate.
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Patent Agency Ranking
公开(公告)号：US11931993B2
公开(公告)日：2024-03-19
申请号：US17639151
申请日：2021-02-02
Inventor： Jia Deng , Jialin Wang , Rongkun Fan , Shengqiang Wu , Xue Meng , Yuanhong Wen , Senlin Ma , Chaoxue Qin , Peng Wang
IPC: B32B41/00 , B32B3/04 , B32B17/06 , B32B37/00 , B32B37/12 , B32B37/22 , H10K50/84 , H10K71/00 , H10K71/50 , H10K77/10 , H10K102/00
CPC classification number: B32B37/003 , B32B3/04 , B32B17/06 , B32B37/1284 , B32B37/22 , B32B41/00 , H10K50/841 , H10K71/00 , H10K71/50 , H10K77/111 , B32B2457/206 , H10K2102/311
Abstract: A bonding method and a bonding device for a flexible panel. In the process of bonding a protective cover plate and the flexible panel, a heated-type optical adhesive is used, the optical adhesive at normal temperature has relatively low viscosity and the viscosity thereof is below a bondable threshold, so that before the flexible panel and the edge of the protective cover plate are bonded, the optical adhesive and the edge of the protective cover plate come into contact in advance and then can be effectively separated, thus poor bonding in a bending region is avoided, the risk of generating bubbles and cracks is small, and the bonding yield can be improved. Moreover, the optical adhesive is increased in viscosity after heated, thereby ensuring that the flexible panel is bonded to the protective cover plate.
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公开(公告)号：US11209110B2
公开(公告)日：2021-12-28
申请号：US16338918
申请日：2018-03-20
Inventor： Xufang Wu , Zhenshan Lu , Ting Cai , Xijiang Zhang , Peng Wang
Abstract: An elbow includes an elbow body, and a pipe wall of the elbow body is saw-toothed along an extending direction of the elbow body so that a bending angle of the elbow body is adjustable.
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公开(公告)号：US09936586B2
公开(公告)日：2018-04-03
申请号：US14910801
申请日：2015-07-30
Inventor： Jie Ge , Peng Wang , Xueling Gao , Yubo Wang , Boning Wang
CPC classification number: H05K3/30 , B65H20/18 , B65H23/26 , B65H35/06 , B65H37/04 , G02F1/1333 , H01L24/75 , H05K2201/10681 , H05K2203/0195
Abstract: An attaching apparatus for chip-on-films includes: a base; a rotary table; a first driving device configured to drive the rotary table to rotate around the axis of the rotary table; a TCP side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the TCP adhesive-attaching region; a PCB side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the PCB adhesive-attaching region; and a pre-pressing mechanism configured to pre-press conductive films attached on a chip-on-film on a carrier located in the pre-pressing region. The rotary table is in a first operating position, a second operating position, a third operating position and a fourth operating position successively during a rotation around its axis. When the rotary table is in any one of the operating positions, there is always one carrier in each region of the base.
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公开(公告)号：US09411233B2
公开(公告)日：2016-08-09
申请号：US14445340
申请日：2014-07-29
Inventor： Xinghuo Li , Tao Wang , Peng Wang , Zhenyong Ding , Yajun Han , Guo Chen
IPC: G03F7/16 , G02F1/13 , H01L21/687
CPC classification number: G03F7/16 , G02F1/1303 , H01L21/68742
Abstract: A support stage comprises a body; at least one pin hole disposed in the body; a lift pin which is received in the pin hole and movable upwards or downwards; at least one groove disposed on a hole wall of the pin hole; and balls which are accommodated in the groove and capable of freely rolling in the groove, wherein the groove is disposed around the lift pin, and is shaped and sized such that each ball is capable of rolling in the groove and a part of each ball projects beyond the hole wall of the pin hole even when the each ball is pressed by the lift pin. With the support stage according to the embodiment of the present invention, the balls are disposed in the groove of the pin hole. In this way, generation of the particles can be alleviated.
Abstract translation: 支持阶段包括身体; 设置在所述主体中的至少一个销孔; 提升销，其被容纳在销孔中并可向上或向下移动; 设置在所述销孔的孔壁上的至少一个槽; 以及容纳在所述槽中并能够在所述槽中自由滚动的滚珠，其中所述凹槽设置在所述提升销周围，并且其形状和尺寸使得每个球能够在所述凹槽中滚动，并且每个球的一部分突出 即使当每个球被提升销按压时，超出针孔的孔壁。 在根据本发明的实施例的支撑台中，球设置在销孔的凹槽中。 以这种方式，可以减轻颗粒的产生。
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公开(公告)号：US20150227044A1
公开(公告)日：2015-08-13
申请号：US14445340
申请日：2014-07-29
Inventor： Xinghuo Li , Tao Wang , Peng Wang , Zhenyong Ding , Yajun Han , Guo Chen
CPC classification number: G03F7/16 , G02F1/1303 , H01L21/68742
Abstract: A support stage comprises a body; at least one pin hole disposed in the body; a lift pin which is received in the pin hole and movable upwards or downwards; at least one groove disposed on a hole wall of the pin hole; and balls which are accommodated in the groove and capable of freely rolling in the groove, wherein the groove is disposed around the lift pin, and is shaped and sized such that each ball is capable of rolling in the groove and a part of each ball projects beyond the hole wall of the pin hole even when the each ball is pressed by the lift pin. With the support stage according to the embodiment of the present invention, the balls are disposed in the groove of the pin hole. In this way, generation of the particles can be alleviated.
Abstract translation: 支持阶段包括身体; 设置在所述主体中的至少一个销孔; 提升销，其被容纳在销孔中并可向上或向下移动; 设置在所述销孔的孔壁上的至少一个槽; 以及容纳在所述槽中并能够在所述槽中自由滚动的滚珠，其中所述凹槽设置在所述提升销周围，并且其形状和尺寸使得每个球能够在所述凹槽中滚动，并且每个球的一部分突出 即使当每个球被提升销按压时，超出针孔的孔壁。 在根据本发明的实施例的支撑台中，球设置在销孔的凹槽中。 以这种方式，可以减轻颗粒的产生。
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