公开(公告)号：US10818732B2

公开(公告)日：2020-10-27

申请号：US16574055

申请日：2019-09-17

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shipei Li ,  Wusheng Li ,  Qi Yao ,  Dongsheng Li ,  Fang He ,  Huili Wu ,  Renquan Gu ,  Sheng Xu ,  Wei He ,  Dongsheng Yin ,  Ying Zhao

IPC: H01L27/30 ,  H01L51/00 ,  H01L51/44 ,  H01L29/786

Abstract: A photosensitive sensor and a method of manufacturing the photosensitive sensor are disclosed. The photosensitive sensor includes a thin film transistor and a photosensitive element on a substrate, wherein the photosensitive element includes a first electrode, a second electrode, and a photosensitive layer between the first electrode and the second electrode. The second electrode is connected to a drain electrode of the thin film transistor. An orthographic projection of an active layer of the thin film transistor on the substrate is within an orthographic projection of the second electrode on the substrate. The second electrode includes at least two stacked conductive layers, at least one of the at least two stacked conductive layers being a light shielding metal layer.

公开(公告)号：US11309528B2

公开(公告)日：2022-04-19

申请号：US16769374

申请日：2019-10-08

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei He ,  Huili Wu ,  Shipei Li ,  Dongsheng Li ,  Fang He ,  Renquan Gu ,  Sheng Xu ,  Dongsheng Yin ,  Wusheng Li ,  Qi Yao

IPC: H01L51/56 ,  H01L51/00 ,  H01L27/32

Abstract: The present disclosure relates to a method of fabricating a flexible display panel. The method of fabricating the flexible display panel may include forming a photosensitive layer comprising at least one azo group on a carrier substrate; forming a flexible substrate on the photosensitive layer; irradiating the photosensitive layer with ultraviolet light; and peeling off the flexible substrate from the carrier substrate.