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公开(公告)号：US20240164022A1
公开(公告)日：2024-05-16
申请号：US17915707
申请日：2021-11-01
Inventor： Jing WANG , Mingming JIA , Lili WANG , Sha FENG , Chao LIU , Ming ZHAI , Haiwei SUN , Lingyun SHI , Liqiang WANG , Jingjing ZHANG
IPC: H05K1/18 , H01L23/00 , H01L25/075 , H05K1/11
CPC classification number: H05K1/189 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/83 , H05K1/118 , H01L25/0753 , H01L2224/05573 , H01L2224/06155 , H01L2224/32225 , H01L2224/8313 , H01L2224/83201 , H05K2201/056 , H05K2201/10128
Abstract: A display module includes a display panel with a plurality of bonding electrodes arranged at intervals along a selected side edge of a non-display surface and divided into two bonding electrode groups, a first flexible circuit board and a second flexible circuit board. For the first flexible circuit board, each first conductive contact piece in a first wiring region is connected to a bonding electrode in a first bonding electrode group. For the second flexible circuit board, each second conductive contact piece in a second wiring region is connected to a bonding electrode in a second bonding electrode group. The first wiring region is closer to the selected side edge than the second wiring region in a first direction. The first fan-out region is spaced apart from the second wiring region in a second direction perpendicular to the first direction.
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12.发明申请公开(公告)号：US20220302362A1
公开(公告)日：2022-09-22
申请号：US17556224
申请日：2021-12-20
Inventor： Linhui GONG , Liang SUN , Chao LIU , Sha FENG
Abstract: The present disclosure provides a display panel and a manufacturing method thereof, a display apparatus and a splicing display apparatus. The display panel includes: a back plate, at least one connection lead and a first protection layer. Each of the at least one connection lead includes a main conductive layer. The first protection layer includes a first portion on two sides of the main conductive layer of the connection lead in a width direction thereof.
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13.发明申请公开(公告)号：US20190235297A1
公开(公告)日：2019-08-01
申请号：US16140142
申请日：2018-09-24
Inventor： Guojing MA , Changjian XU , Jinyu REN , Sha FENG
IPC: G02F1/1337 , B44B5/02 , B29C59/04
CPC classification number: G02F1/13378 , B29C59/046 , B44B5/0009 , B44B5/026
Abstract: Embodiments of the present disclosure provide an embossing plate and a manufacturing method thereof, and an alignment layer transfer plate and a manufacturing method thereof. The embossing plate includes an embossing plate body, and a plurality of protrusions distributed in an array are formed on an embossing surface of the embossing plate body. The embossing plate according to the present disclosure can improve a thickness uniformity of the alignment layer and a quality of the surface of the alignment layer.
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14.发明公开公开(公告)号：US20240304762A1
公开(公告)日：2024-09-12
申请号：US18026332
申请日：2022-04-26
Inventor： Yutian CHU , Sha FENG , Zhijun XIONG , Yuanda LU , Liang SUN , Zhaohui LI , Enkai DONG , Jiacheng QI , Jinpeng LI , Qiqi ZHOU , Le WANG
CPC classification number: H01L33/46 , H01L33/62 , H01L2933/0025 , H01L2933/0066
Abstract: Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer disposed on a side, facing away from the substrate, of the light-emitting structure; at least two sub-light-emitting auxiliary bonding layers disposed on a side, facing away from the light-emitting structure, of the reflective layer; and a raised portion, disposed on a side, facing away from the light-emitting structure, of the reflective layer, an orthographic projection of the raised portion on the substrate and an orthographic projection of the sub-light-emitting auxiliary bonding layers on the substrate do not overlap with each other, and a thickness of the raised portion is smaller than a thickness of each of the at least two sub-light-emitting auxiliary bonding layers.
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Patent Agency Ranking
公开(公告)号：US20240258476A1
公开(公告)日：2024-08-01
申请号：US18007404
申请日：2022-02-25
Inventor： Lili WANG , Chao LIU , Ming ZHAI , Jing WANG , Sha FENG , Mingming JIA , Shaofei GUO , Bao FU , Qiuhua MENG , Qi QI , Lingyun SHI , Haiwei SUN
IPC: H01L33/62 , H01L25/075
CPC classification number: H01L33/62 , H01L25/0753
Abstract: A display panel includes: a backplane, light-emitting devices, first electrodes, and connection traces. The backplane includes a first surface, a second surface opposite thereto, and side surfaces connecting the two surfaces. At least one of the side surfaces is a selected side surface. The light-emitting devices are disposed on the first surface. The first electrodes are disposed on the first surface and are proximate to the selected side surface. Each connection trace includes a first trace segment, a second trace segment, and a third trace segment that are connected in sequence. The first trace segment is disposed on the first surface, and the first trace segment is electrically connected to a first electrode. The second trace segment is disposed on the selected side surface. The third trace segment is disposed on the second surface, and is configured to be electrically connected to a flexible printed circuit.
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公开(公告)号：US20240186470A1
公开(公告)日：2024-06-06
申请号：US17796091
申请日：2021-08-27
Inventor： Chuhang WANG , Sha FENG , Chao LIU , Lili WANG , Mingming JIA , Jing WANG , Ming ZHAI
IPC: H01L33/62 , H01L25/075
CPC classification number: H01L33/62 , H01L25/0753 , H01L2933/0066
Abstract: A display panel includes a display substrate having a display area and at least one wiring area, and a protective film including a first protective portion and at least one second protective portion. The first protective portion is disposed on a display side of the display substrate, and covers the display area. The at least one second protective portion each covers a wiring area in the at least one wiring area, and is bent from the display side of the display substrate to a non-display side of the display substrate, by a side of the display substrate. The at least one second protective portion each includes a main film layer and a wiring layer. The wiring layer includes a plurality of wirings. At least one wiring extends from the display side of the display substrate to the non-display side of the display substrate, by the side of the display substrate.
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17.发明公开公开(公告)号：US20240097085A1
公开(公告)日：2024-03-21
申请号：US18262828
申请日：2022-07-04
Inventor： Lili WANG , Sha FENG , Chao LIU , Jing WANG , Mingming JIA , Chuhang WANG , Qi QI
CPC classification number: H01L33/60 , H01L25/167 , H01L2933/0058
Abstract: A display panel (10) includes a circuit backplane (1) and a reflective layer (3). The circuit backplane (1) includes a first main surface (11), a second main surface (12), and a plurality of side surfaces (13). The second main surface (12) is disposed opposite to the first main surface (11). The side surfaces (13) each connect the first main surface (11) and the second main surface (12). At least one side surface in the plurality of side surfaces (13) is a selected side surface (13a). The selected side surface (13a) is covered by the reflective layer (3), the reflective layer (3) being configured to be removed under a predetermined process condition.
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公开(公告)号：US20210367182A1
公开(公告)日：2021-11-25
申请号：US16475429
申请日：2018-12-06
Inventor： Mengmeng LU , Sha FENG , Bo ZHOU , Yongzhi SONG
Abstract: Embodiments of the present disclosure provide a packaging method, an electronic device, and a packaging apparatus. The packaging method includes: providing a first substrate and a second substrate; and cell-assembling the first substrate and the second substrate to sandwich a filling glue between the first substrate and the second substrate to form a packaging structure, the filling glue is mixed with electrophoretic liquid encapsulated by a capsule, and the electrophoretic liquid includes an electrophoretic particle; in a process of cell-assembling the first substrate and the second substrate, applying an electric field to control the electrophoretic particle to move directionally to deform the capsule.
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19.发明申请公开(公告)号：US20200058302A1
公开(公告)日：2020-02-20
申请号：US16610254
申请日：2019-04-24
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Abstract: A lip-language identification method and an apparatus thereof, an augmented reality device and a storage medium. The lip-language identification method includes: acquiring a sequence of face images for an object to be identified; performing lip-language identification based on a sequence of face images so as to determine semantic information of speech content of the object to be identified corresponding to lip actions in a face image; and outputting the semantic information.
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