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11.
公开(公告)号:US11271184B2
公开(公告)日:2022-03-08
申请号:US16192860
申请日:2018-11-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Donghui Yu , Wenjun Hou
Abstract: The present disclosure provides an OLED package structure, OLED device, display device and method for fabricating OLED package structure. The OLED package structure includes a substrate, a cover plate and a first sealant layer. The substrate, the cover plate and the first sealant layer together delimiting a sealed space. The OLED package structure further includes a functional sealant layer formed by filling the sealed space with a functional sealant, and a second sealant layer formed by a second sealant disposed between the substrate and the functional sealant layer. The second sealant has a density less than a density of the functional sealant.
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公开(公告)号:US11239282B2
公开(公告)日:2022-02-01
申请号:US16070802
申请日:2018-01-03
Applicant: BOE Technology Group Co., Ltd.
Inventor: Donghui Yu
Abstract: The present disclosure provides a pixel structure and a fabrication method thereof, a display substrate and a display apparatus. The pixel structure includes a plurality of first pixel portions arranged in a plurality of rows and a plurality of columns, and a second pixel portion that spaces the plurality of first pixel portions from each other. Each first pixel portion includes a plurality of first sub-pixels having a same color and arranged around a center of the first pixel portion. The second pixel portion includes a plurality of second sub-pixels. For four first pixel portions in two adjacent rows and two adjacent columns, each of four regions that are centrosymmetric and obtained by connecting centers of the four first pixel portions to each other corresponds to one pixel unit, and each pixel unit includes two first sub-pixels respectively in two first pixel portions and at least one second sub-pixel.
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13.
公开(公告)号:US10991902B2
公开(公告)日:2021-04-27
申请号:US16729405
申请日:2019-12-29
Applicant: BOE Technology Group Co., Ltd.
Inventor: Donghui Yu
Abstract: There provide an organic light emitting diode substrate and preparation method thereof and a display panel. The preparation method includes: forming a pixel defining layer which defines a pixel region and has a via hole on a base; forming an auxiliary electrode in the via hole; forming a capsule structure encapsulating a conductive liquid on the auxiliary electrode; expanding the capsule structure to be broken so as to enable the conductive liquid to form a connection electrode; and forming a first electrode covering the base, the first electrode being connected to the auxiliary electrode through the connection electrode. In the present disclosure, the connection electrode is formed through the capsule structure encapsulating the conductive liquid, so that the first electrode is connected to the auxiliary electrode through the connection electrode. The preparation process is simpler and the production cost is lower.
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公开(公告)号:US10964758B2
公开(公告)日:2021-03-30
申请号:US16613133
申请日:2019-04-08
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Guang Yan , Wenjun Hou , Juanjuan You , Donghui Yu , Chunjing Hu , Yongqi Shen , Dongfang Yang
Abstract: A pixel unit, a display panel, a display device and a method of manufacturing a pixel unit. The pixel unit includes a first sub-pixel unit and a second sub-pixel unit, each sub-pixel unit includes a first electrode, an emission layer, and a second electrode stacked on a substrate. An emission lifespan of the emission layer of the first sub-pixel unit is smaller than that of the emission layer of the second sub-pixel unit. An area of an orthographic projection of the emission layer of the first sub-pixel unit on the substrate is equal to that of the emission layer of the second sub-pixel unit on the substrate. An area of an orthographic projection of the first electrode of the first sub-pixel unit on the substrate is greater than an area of an orthographic projection of the first electrode of the second sub-pixel unit on the substrate.
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公开(公告)号:US09806292B2
公开(公告)日:2017-10-31
申请号:US14914074
申请日:2015-07-20
Applicant: Boe Technology Group Co., Ltd.
Inventor: Wenfeng Song , Chunjan Wang , Donghui Yu
CPC classification number: H01L51/5256 , H01L27/32 , H01L51/52 , H01L51/56 , H01L2251/303
Abstract: An OLED packaging method, a packaged structure, and a display device are disclosed. The packaging method comprises forming at least one group of films on an OLED to be packaged. Each group of films comprises three films, and an intermediate film in each group of films is an intermediate inorganic-organic hybrid layer. The intermediate inorganic-organic hybrid layer is arranged as an intermediate film in each group of films, and connects an upper film and a lower film in each group of films, so that adhesion between the upper film and the lower film in each group of films is effectively improved, and stripping of the upper and lower films is avoided.
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公开(公告)号:US09768409B2
公开(公告)日:2017-09-19
申请号:US14762048
申请日:2014-12-04
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Donghui Yu , Chun Jan Wang , Chengyuan Luo
IPC: H01L51/52
CPC classification number: H01L51/5246
Abstract: An electroluminescent device and a display device are provided. The electroluminescent device includes: a base substrate (100), a first surface of which is provided with a luminous element (110); a first substrate (210) having a first groove arranged to be opposed to the first surface of the base substrate (100); a sealing element (300) hermetically secured with a wall of the first groove, protruding from a notch of the first groove, and having a sealing groove provided to be opposed to a first surface of the base substrate (100); a part of the sealing element (300) protruding from the notch of the first groove is hermetically secured with the base substrate (100), and the luminous element (110) is arranged within the sealing groove. The electroluminescent device and display device depress the probability of the moisture in the air entering the sealing element and contacting with the luminous element, thus improving the performance and life of the electroluminescent device.
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公开(公告)号:US11825691B2
公开(公告)日:2023-11-21
申请号:US15824605
申请日:2017-11-28
Applicant: BOE Technology Group Co., Ltd.
Inventor: Donghui Yu
IPC: H01L29/08 , H10K59/00 , H10K50/84 , H10K50/842 , H10K71/00 , H10K102/00
CPC classification number: H10K59/00 , H10K50/841 , H10K50/846 , H10K50/8426 , H10K71/00 , H10K2102/331
Abstract: Embodiments of the present disclosure disclose a display panel and a fabricating method thereof. In the solution, on one hand, water-absorbing magnetic nanoparticles in a packaging layer are distributed along a direction perpendicular to the cover plate at a side far away from an OLED component, or distributed along an extension direction of the packaging layer at a periphery of a region in which the OLED component is located, thus reducing the damage to the OLED component of a display substrate. On the other hand, since the water-absorbing magnetic nanoparticles have magnetic property, the water-absorbing magnetic nanoparticles can be doped in the packaging layer material in a packaging and waterproofing process, and a magnetic field is applied to induce the magnetic nanoparticles to move to the side far away from the OLED component or to the periphery of the region in which the OLED component is located.
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公开(公告)号:US11387436B2
公开(公告)日:2022-07-12
申请号:US16470631
申请日:2018-11-15
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Donghui Yu , Guang Yan , Chunjing Hu
Abstract: An inkjet printing method of an array substrate, an array substrate, and a display device are disclosed. The array substrate includes n kinds of sub-pixels; and the inkjet printing method includes: recording a solvent volume required for inkjet printing of an i-th kind of sub-pixel as Vi; calculating an Xi value for each kind of the n kinds of sub-pixels, in which Xi=Vi/V1, and V1 refers to a solvent volume required for inkjet printing of a first kind of sub-pixels; taking a greatest common divisor of the Xi values of the n kinds of sub-pixels, and recording the greatest common divisor as G; and dividing the i-th kind of sub-pixel into Xi/G subunits with equal areas, and performing inkjet printing on each of the subunits of the i-th kind of sub-pixel with a solvent volume of V1*G to form a film layer.
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公开(公告)号:US20210167322A1
公开(公告)日:2021-06-03
申请号:US16998161
申请日:2020-08-20
Applicant: BOE Technology Group Co., Ltd.
Inventor: Donghui Yu
Abstract: Embodiments of the present disclosure provide a display panel and a method of manufacturing the same, and a display apparatus. The display panel includes: a display substrate; a packaging cover plate; a sealing assembly. The sealing assembly includes a box dam structure, a buffer structure and a filling structure, the box dam structure forms a sealing space together with the display substrate and the packaging cover plate, the buffer structure and the filling structure are located in the sealing space, and the buffer structure is located between the box dam structure and the filling structure. The box dam structure is made of a first material, the buffer structure includes a second material, the filling structure is made of a third material, and a viscosity of the second material is greater than a viscosity of the third material and less than a viscosity of the first material.
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20.
公开(公告)号:US10586940B2
公开(公告)日:2020-03-10
申请号:US16007188
申请日:2018-06-13
Applicant: BOE Technology Group Co., Ltd.
Inventor: Donghui Yu
Abstract: There provide an organic light emitting diode substrate and preparation method thereof and a display panel. The preparation method includes: forming a pixel defining layer which defines a pixel region and has a via hole on a base; forming an auxiliary electrode in the via hole; forming a capsule structure encapsulating a conductive liquid on the auxiliary electrode; expanding the capsule structure to be broken so as to enable the conductive liquid to form a connection electrode; and forming a first electrode covering the base, the first electrode being connected to the auxiliary electrode through the connection electrode. In the present disclosure, the connection electrode is formed through the capsule structure encapsulating the conductive liquid, so that the first electrode is connected to the auxiliary electrode through the connection electrode. The preparation process is simpler and the production cost is lower.
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