公开(公告)号：US20240315115A1

公开(公告)日：2024-09-19

申请号：US18027221

申请日：2022-01-14

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqi LIU ,  Zhongyuan SUN ,  Che AN ,  Jingkai NI ,  Qingyu HUANG ,  Jinxiang XUE ,  Guangcai YUAN ,  Chunyan LI

IPC: H10K59/80 ,  H10K59/12 ,  H10K59/38 ,  H10K102/00

CPC classification number: H10K59/8731 ,  H10K59/1201 ,  H10K59/38 ,  H10K2102/351

Abstract: A display substrate and its manufacturing method, a display panel and a display apparatus are provided. The display substrate includes a base (10), a light-emitting device layer (20) on the base (10), and an encapsulation structure (30) on a side of the light-emitting device layer (20) away from the base (10). A film layer farthest from the base (10) in the light-emitting device layer (20) is a light extraction layer (21). The encapsulation structure (30) includes a first inorganic encapsulation layer (31), an organic encapsulation layer (32) on a side of the first inorganic encapsulation layer (31) away from the base (10), and a second inorganic encapsulation layer (33) on a side of the organic encapsulation layer (32) away from the base (10). The first inorganic encapsulation layer (31) includes sub-film layers in which the one closest to the light extraction layer (21) is a low-stress inorganic layer (301) with a stress less than that of the second inorganic encapsulation layer (33). The display panel includes the display substrate. The display apparatus includes the display panel.

公开(公告)号：US20230363202A1

公开(公告)日：2023-11-09

申请号：US17613998

申请日：2020-12-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jinxiang XUE ,  Zhongyuan SUN ,  Guoqiang WANG ,  Wenqi LIU ,  Jingkai NI ,  Che AN

IPC: H10K59/12 ,  H10K59/131 ,  H10K59/127 ,  H10K59/80

CPC classification number: H10K59/1201 ,  H10K59/131 ,  H10K59/127 ,  H10K59/87 ,  H10K2102/3026

Abstract: The present disclosure provides a display substrate, which includes a base substrate, and a display unit, a connection unit and a hollowed-out unit, which are adjacent to each other, on the base substrate; the display unit includes a first insulating part and a conductive part; the connection unit includes a second insulating part and a conductive connecting part, the second insulating part is arranged on a side of the conductive connecting part away from the base substrate; the conductive connecting part is in contact with the base substrate, extends from an area of the base substrate where the connection unit is located to an area of the base substrate where the display unit is located, and is electrically coupled to the conductive part through a via hole formed in the first insulating part; the second insulating part has a tensile property superior to the first insulating part.

公开(公告)号：US20220384747A1

公开(公告)日：2022-12-01

申请号：US17771015

申请日：2021-06-10

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhongyuan SUN ,  Meng YAN ,  Che AN ,  Guangcai YUAN ,  Jinnv LIU

IPC: H01L51/00 ,  H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: A display substrate (910), including a flexible substrate body, a thickness adjustment layer (71), and a micro-lens layer (72). The flexible substrate body includes: a plurality of island-shaped display regions (100) spaced apart from each other, a hollow region (300) disposed between adjacent island-shaped display regions (100), and a connection region (200) for connecting the adjacent island-shaped display regions (100). The thickness adjustment layer (71) is disposed on light exit sides of the plurality of island-shaped display regions (100) of the flexible substrate body. The micro-lens layer (72) is disposed on the side of the thickness adjustment layer (71) away from the flexible substrate body.

公开(公告)号：US20220344422A1

公开(公告)日：2022-10-27

申请号：US17763919

申请日：2021-05-12

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jinxiang XUE ,  Xiaolei ZHANG ,  Zhongyuan SUN ,  Wenqi LIU ,  Kai SUI ,  Jingkai NI ,  Xiang ZHOU ,  Che AN ,  Guoqiang WANG

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: Disclosed is a flexible display substrate, including: a substrate base layer, peripheral side edges of the substrate base layer having a first stepped structure having a process performance, the first stepped structure being configured to enable a film layer covering the first stepped structure to be easily broken at the stepped structure when a force is applied; a functional layer provided on the substrate base layer and exposed to the outside of the first stepped structure; and an inorganic encapsulation layer covering side edges of the functional layer and extending to the first stepped structure of the side edges of the substrate base layer.